Au Optronics Corporation

Jia-Hong Ye

Wu-Hsiung Lin

Ssu-Hui Lu

Ming-Hsien Lee

Wei-Ming Huang

Chia-Tien Peng

Kuo-Yu Huang

Chao-Chien Chiu

Ching-Liang Huang

Shin-Shueh Chen

Po-Hsueh Chen

Pin-Fan Wang

Guang-Ren Shen

Hsueh-Fang Yeh

Cheng-Syun Sie

A circuit substrate includes a substrate, an active device, a first signal line, a second signal line, a shielding electrode, a data line, a pixel electrode, and a common electrode. The first signal line is electrically connected to the active device, and includes a main portion and a connection portion connected to the main portion. The main portion extends along a first direction. The second signal line extends along a second direction. The second signal line is electrically connected to the connection portion. The shielding electrode overlaps the connection portion in a normal direction of the substrate. The shielding electrode and the second signal line belong to a same conductive layer. The data line is electrically connected to the active device. The common electrode is electrically connected to the shielding electrode.

Circuit substrate

An active device substrate includes a substrate, a first active device, and a second active device. The first active device includes a first gate, a crystallized metal oxide layer, a first insulation layer, a first source, and a first drain. The crystallized metal oxide layer is located on the first gate. The first insulation layer is sandwiched between the crystallized metal oxide layer and the first gate. An area from the top surface of the crystallized metal oxide layer to the bottom surface of the crystallized metal oxide layer is observed via a selected area diffraction mode of a transmission electron microscope, and a diffraction pattern of a crystallized phase can be observed. The second active device includes a second gate, a silicon semiconductor layer, a second source, and a second drain. A manufacturing method of an active device substrate is further provided.

Active device substrate and manufacturing method thereof

A backlight module and display device using the same are provided. The backlight module has a light guide plate. A piezoelectric module is arranged at the outer side of the backside surface of the light guide plate and configured to produce a vibration. The vibration is directly or indirectly transmitted to a resonator, for example, a light guide plate or a bezel, to produce resonance, and a space to which the backside surface is oriented is used as a resonance cavity. By means of the arrangement, the screen-to-body ratio of electronic products and the sound quality can be improved while taking into account the thickness and volume of the electronic products.

Backlight module and display device using the same

A manufacturing method of a crystallized metal oxide layer includes: providing a substrate; forming a first insulation layer on the substrate; forming a first metal oxide layer on the first insulation layer; forming a second metal oxide layer on the first insulation layer; forming a second insulation layer on the first metal oxide layer and the second metal oxide layer; forming a silicon layer on the second insulation layer; performing a first laser process on a portion of the silicon layer covering the first metal oxide layer; and performing a second laser process on a portion of the silicon layer covering the second metal oxide layer. An active device and a manufacturing method thereof are also provided.

Manufacturing method of a pair of different crystallized metal oxide layers

An opposite substrate including a substrate, first light-shielding patterns, second light-shielding patterns, a planarization layer and support members is provided. The support members are located in primary support regions and secondary support regions of the opposite substrate. The first light-shielding patterns respectively extend along a first direction, and a material of the first light-shielding patterns includes an organic material. The second light-shielding patterns respectively extend along a second direction, and a material of the second light-shielding patterns includes metal. The first light-shielding patterns and the second light-shielding patterns are respectively located at opposite sides of the planarization layer. Alternatively, the first light-shielding patterns and the second light-shielding patterns are located at the same side of the planarization layer, and the planarization layer has openings respectively overlapped with the support members located in the secondary support regions.

Opposite substrate

The present invention provides two methods for crystallizing a metal oxide semiconductor layer and a semiconductor structure. The first crystallization method is treating an amorphous metal oxide semiconductor layer including indium with oxygen at a pressure of about 550 mtorr to about 5000 mtorr and at a temperature of about 200&#xb0; C. to about 750&#xb0; C. The second crystallization method is, firstly, sequentially forming a first amorphous metal oxide semiconductor layer, an aluminum layer, and a second amorphous metal oxide semiconductor layer on a substrate, and, secondly, treating the first amorphous metal oxide semiconductor layer, the aluminum layer, and the second amorphous metal oxide semiconductor layer with an inert gas at a temperature of about 350&#xb0; C. to about 650&#xb0; C.

Semiconductor structure and methods for crystallizing metal oxide semiconductor layer

The present invention provides a method for crystallizing a metal oxide semiconductor layer, a semiconductor structure, a method for manufacturing a semiconductor structure, an active array substrate, and an indium gallium zinc oxide crystal. The crystallization method includes the following steps: forming an amorphous metal oxide semiconductor layer on a substrate; forming an oxide layer on the amorphous metal oxide semiconductor layer; forming an amorphous silicon layer on the oxide layer; and irradiating the amorphous silicon layer by using a laser, so as to heat the amorphous silicon layer, where the heated amorphous silicon layer heats the amorphous metal oxide semiconductor layer, so that the amorphous metal oxide semiconductor layer is converted into a crystallized metal oxide semiconductor layer.

Method for crystallizing metal oxide semiconductor layer, semiconductor structure, active array substrate, and indium gallium zinc oxide crystal

An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 &#x3bc;m and 1000 &#x3bc;m.

Array substrate

A liquid crystal lens including a first substrate, a first electrode disposed on the first substrate, a second electrode disposed on the first substrate, a first conductive pattern disposed on the first substrate, a second conductive pattern disposed on the first substrate, a second substrate disposed opposite to the first substrate, a common electrode disposed on the second substrate, and a liquid crystal layer located between the first substrate and the second substrate is provided. The first conductive pattern and the second conductive pattern are electrically connected between the first electrode and the second electrode. A resistivity of the first conductive pattern and a resistivity of the second conductive pattern are greater than a resistivity of the first electrode and a resistivity of the second electrode. At least a portion of the at least one second conductive pattern is disposed into the at least one first conductive pattern.

Liquid crystal lens

A method of fabricating a thin film transistor including following steps is provided. Sequentially form a semiconductor layer, a metal layer and an auxiliary layer on a substrate. Perform a crystallization process to transform the semiconductor layer into an active layer after the metal layer and the auxiliary layer are disposed on the semiconductor layer. After the active layer is formed, pattern the metal layer to form a source and a drain. Form a gate insulator and a gate. The gate insulator is disposed between the gate and the source and drain.

Method of fabricating thin film transistor

An active device array substrate includes a flexible substrate, a gate electrode, a dielectric layer, a channel layer, a source electrode, a drain electrode, and a pixel electrode. The flexible substrate has a transistor region and a transparent region adjacent to each other. The gate electrode is disposed on the transistor region. The dielectric layer covers the flexible substrate and the gate electrode. A portion of the dielectric layer disposed on the gate electrode has a first thickness. Another portion of the dielectric layer disposed on the transparent region has a second thickness less than the first thickness. The channel layer is disposed above the gate electrode. The source electrode and the drain electrode are electrically connected to the channel layer. The pixel electrode is disposed on the dielectric layer which is disposed on the transparent region. The pixel electrode is electrically connected to the drain electrode.

Active device array substrate

A method for manufacturing an active device array substrate includes providing a flexible substrate having a transistor region and a transparent region; forming a gate electrode on the transistor region; sequentially forming a dielectric layer and a semiconductor layer to cover the gate electrode and the flexible substrate; removing a part of the semiconductor layer to form a channel layer above the gate electrode and removing a thickness of the dielectric layer disposed on the transparent region, such that a portion of the dielectric layer on the gate electrode has a first thickness, and another portion of the dielectric layer on the transparent region has a second thickness less than the first thickness; respectively forming a source electrode and a drain electrode on opposite sides of the channel layer; and forming a pixel electrode electrically connected to the drain electrode.

Active device array substrate and manufacturing method thereof

A pixel structure and a manufacturing method thereof are provided. In the pixel structure, an electrode of a storage capacitor is formed when an active layer is formed, and the electrode and the active layer are made of the same material. The material of the electrode and the active layer can be an oxide semiconductor with high transmittance. Therefore, a stable display frame of the pixel structure can be provided by the storage capacitor, an aperture ratio of the pixel structure can be improved, and power consumption can be further reduced.

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Hsin-Chu, Taiwan

Jia-Hong Ye