Foxconn Technology Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Shenzhen Fulian Fugui Precision Industry Co., Ltd.

Jia-Hong Wu

Li-Wen Guo

Sheng-Liang Dai

Hsin-Ting Lin

An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.

Immersion cooling system in miniaturized form

An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.

Immersion cooling system

An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.

Electronic device and heat dissipating casing thereof

A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.

Growing community of inventors

Taipei, Taiwan

Jia-Hong Wu