Invensense, Inc.

Analog Devices,inc.

Jia Gao

Jicheng Yang

Aleksey Sergeyevich Khenkin

Kieran P Harney

Thomas M Goida

Dipak Sengupta

Manolo G Mena

Asif Chowdhury

Carlo Tiongson

Brian H Kim

Peter George Hartwell

Xiaojie Xue

Mozafar Maghsoudnia

Shafi Saiyed

Richard Sullivan

Siu Lung Ng

Rick Sullivan

Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.

Integrated package containing MEMS acoustic sensor and pressure sensor

A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.

MEMS microphone system for harsh environments

A size of a port hole in a package for a micro-electro-mechanical (MEMS) microphone can be modified to improve performance of the MEMS microphone while protecting the MEMS microphone from environmental interference. As an example, the port hole diameter is increased along a thickness of a substrate coupled to the MEMS microphone to reduce air mass loading and air flow resistance and thus, increase the resonant frequency, resonant peak, signal-to-noise ratio (SNR) and/or a range for flat frequency response of the MEMS microphone. In one aspect, the port hole can be created by mechanical and/or laser drilling. In another aspect, the port hole can be created by forming a cavity in the substrate over a drilled port hole.

Packaging concept to improve performance of a micro-electro mechanical (MEMS) microphone

Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Packages and methods for packaging

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Air-release features in cavity packages

Packages and methods for packaging using a lid having multiple conductive layers

Growing community of inventors

Winchester, MA, United States of America

Jia Gao