Bgt Materials Limited

Other

Graphene Security Limited

Jia-Cing Chen

Chung-Ping Lai

Kuo-Hsin Chang

We-Jei Ke

Jingyu Zhang

A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.

Method of manufacturing a polymer printed circuit board

A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20&#xb0; C. to 100&#xb0; C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.

Heat dissipation coating layer and manufacturing method thereof

A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200&#xb0; C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Method of manufacturing a hexagonal boron nitride based laminate on LED filament

A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Method of manufacturing polymer printed circuit board

A RFID security structure for a document contains: a RFID antenna and a RFID chip. The RFID antenna is made of conductive inks printed on the document, and the RFID chip is attached on and is electrically connected with the RFID antenna. When the covering layer is removed from the document, the RFID antenna is broken. Accordingly, a portion of the RFID antenna attaches on the covering layer, and the other portion of the PRID antenna remains on the RFID security document or the substrate, hence the RFID security document is not tampered or is not imitated.

RFID security document

A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

Method of making highly flexible and conductive printed graphene-based laminate for wireless wearable communications

A hexagonal boron nitride heat dissipation structure includes a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element. Each electronic component is configured to generate heat, each thermally conductive buffer layer is made of hBN that has thermal conductivity range from 10 to 40 W/mK. Such structure can completely overcome the issue of short circuit of electronic devices. The cooling of modern electronic devices, which has limited space for cooling, can be improved by this simple structure that takes full advantage of hBN and other heat dissipation materials.

Hexagonal boron nitride heat dissipation structure

A hybrid tag is employed to magnetic system and radio frequency system and contains: an IC chip and an antenna electrically connected with the IC chip. The IC chip includes a memory storage unit configured to store digital data, and the antenna is made of mixture composition in a printing manner, wherein the mixture composition includes electrically conductive material, magnetic material, dispersant and adhesive, and wherein the hybrid tag responds magnetic waves within low frequency (LF) range and responds radio frequency signals within high frequency (HF) range, ultra high frequency (UHF) range, and microwave range. Thereby, the hybrid tag is manufactured easily at low production cost.

Growing community of inventors

Tainan, Taiwan

Jia-Cing Chen