Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Jia-Chong Ho

Cheng-Chung Lee

Tarng-Shiang Hu

Liang-Ying Huang

Yu-Yang Chang

Jing-Yi Yan

Jyh-Rong Sheu

Yu-Wu Wang

Yi-Kai Wang

Chun-Tao Lee

Wei-Ling Lin

Wen-Kuei Huang

Chi-Chang Liao

Kuang-Jung Chen

Shu-Tang Yeh

Tsung-Hsien Lin

Cheng-Chung Hsieh

Chih-Chia Chang

Heng-Yin Chen

Chao-Jen Wang

Hua-Chi Cheng

Hsiang-Yuan Cheng

Yung-Hui Yeh

Shin-Hong Kuo

Ming-Huan Yang

Yi-Hsiang Huang

Tai-Jui Wang

Wei-Yi Lin

Ming-Chun Hsiao

Chen-Chu Tsai

Sheng-Po Wang

Liang-Hsiang Chen

Jane-Hway Liao

Chai-Yuan Sheu

Horng-Long Cheng

Wei-Han Chen

Lung-Pin Hsin

Kun-Lin Chuang

Liang-Yin Huang

Tzu-Yi Yu

Wei-Yang Chou

Ming-Chou Chen

Ching-Hsiang Chan

Jen-Hao Lee

Kuo-Ping Chang

Chien-Hsien Yu

Tzu-Wei Lee

Jen-Shyang Ni

Pzng Lin

Ying-Hsien Cheng

Yun-Chiao Hsiao

Ya-Lang Chen

An information display method and an information display apparatus suitable for multi-person viewing are provided. The method is adapted to an electronic apparatus having a transparent display and a processor, and the method includes following steps: detecting a plurality of users viewing the transparent display, and calculating a gaze range of each user viewing the transparent display; calculating an intersection range of the gaze ranges of the users and determining whether a ratio of the intersection range to the gaze ranges exceeds a preset intersection ratio; displaying object information of the objects appeared in the gaze range according to each of the gaze ranges if the ratio does not exceed the preset intersection ratio; and displaying object information of the objects appeared in the gaze range according to the intersection range if the ratio exceeds the preset intersection ratio.

Information display method and information display apparatus suitable for multi-person viewing

A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Photoelectric device package

A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.

Flexible electronic device and fabricating method thereof

A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Flexible electronic module and manufacturing method thereof

According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Chip package and chip packaging method

A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Electronic device package structure and manufacturing method thereof

A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein R, Rand Rare respectively hydrogen, a Cto Csubstituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

Flexible substrate repair structure, manufacturing method thereof, and inspection and repair method of flexible substrate

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

Environmental sensitive electronic device package

A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

Package of environmental sensitive element

A stacked structure including a soluble organic semiconductor material and a water soluble photosensitive material is provided. The water soluble photosensitive material is disposed on the surface of the soluble organic semiconductor material.

Method of patterning stacked structure

A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10g/m/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.

Package of environmentally sensitive electronic device and fabricating method thereof

A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible substrate is directly formed on the interfacing layer. The flexible substrate fully contacts the interfacing layer. A device structure is then formed on the flexible substrate.

Method of fabricating a device with flexible substrate and method for stripping flexible-substrate

A top-emitting OLED display and fabrication method thereof are provided. The top-emitting OLED display includes providing a handling substrate. A composite layer is formed on the handling substrate. An organic light emitting unit is formed on the composite layer. A top electrode is formed on the organic light emitting unit. A reflective type display and fabrication method thereof are provided. The reflective type display includes providing a handling substrate. A composite layer is formed on the handling substrate, a thin film transistor array is formed on the composite layer.

Reflective liquid crystal display, top-emitting OLED display and fabrication method thereof

A method of TFT (Thin Film Transistor) manufacturing and a substrate structure are provided. The structure includes a substrate and a self-alignment mask. A self-alignment mask on a substrate is first manufactured and then the self-alignment mask may synchronously extend with the substrate during the thermal process. When an exposure light source is provided on the side without a TFT formed, the self-alignment mask can overcome the problem that when a plastic substrate extends, the positions of the source and drain to be formed on the plastic substrate are incorrect, which has a great effect on the accuracy of alignment. As the result, the positions of the source and drain can be defined accurately.

Substrate structure for a thin film transistor

A TFT and an OLED device are provided. The TFT includes a substrate, a gate, a gate insulator, a source/drain layer, an isolated layer, and a channel layer. The gate is disposed on the substrate. The gate insulator is disposed on the substrate and covers the gate. The source/drain layer is disposed on the gate insulator, and exposes a portion of the gate insulator above the gate. The isolated layer is disposed on the source/drain layer and has an opening to expose a portion of the gate insulator and a portion of the source/drain layer above the gate. The channel layer is disposed in the opening of the isolated layer. Further, the channel layer is exposed by the opening and is electrically connected to the source/drain layer. On the other hand, the OLED device mainly includes a driving circuit and an organic electro-luminescent unit.

Thin film transistor and organic electro-luminescent display device

Growing community of inventors

Hsinchu County, Taiwan

Jia-Chong Ho