Industrial Technology Research Institute

Jia-Chi Huang

Shih-Ming Chen

Chih-Kuang Chen

Li-Ching Wang

Tzong-Ming Lee

Kuo-Chan Chiou

Feng-Po Tseng

Young-Jen Lee

Lu-Shih Liao

Tzu-Ting Lin

A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein nis an integer 2-25, Ris Calkyl or H, and Ris H or CH; and about 10-45 parts by weight of a bi-functional acrylic oligomer of formula (II), wherein nis an integer 3-50, Rand Rare H or CH.

Transparent flexible film and fabrication method thereof

The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 &#x3bc;m and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7.

Antiglare film and manufacturing method thereof

A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same

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Hsinchu County, Taiwan

Jia-Chi Huang