Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Ji-Yun Qin

Zhi-Yong Zhou

Tao Li

Wan-Lin Xia

Wei Chen

Min-Qi Xiao

Hao-Xia Liu

Xiao-Jian He

A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.

Heat dissipation device

A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.

A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.

Heat dissipation assembly

A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.

Heat dissipation device having a fan holder for attachment of a fan

A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.

A heat dissipation device for an electronic unit includes a heat sink (), a pair of first heat pipes () and a pair of second heat pipes (). The heat sink includes a base () for contacting with the electronic unit (), a plate () spaced from the base, and a plurality of fins () arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions () sandwiched between the base and a bottom portion () of the fins for absorbing heat from the base, and condensing portions () thermally sandwiched between a top portion () of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

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Shenzhen, China

Ji-Yun Qin