Korea Institute of Science and Technology

Ji Young Byun

Kwang-Deok Choi

Seung Yong Lee

So Hye Cho

Yun Hee Kim

In Uk Baek

Sang Hoon Kim

Dong Kyu Kim

Jong Sik Kim

Jae Chul Lee

Hyungduk Ko

Jae Soo Kim

Ho In Lee

Kwang Koo Jee

Jong Chul Shin

Jin-Kook Yoon

Jung Mann Doh

Hye Sung Kim

Doo Yong Kim

Jong Kown Lee

Dae Ho Rho

Ju Yong Jung

Kyeung Ho Kim

Kyu Won Cho

Hyeon Joon Shin

Dong Hwa Kum

Jung Gu Kim

Honguk Cheon

Inuk Baek

Md Abdur Rahman

Sung Lim Choi

Jun Hyun Han

Jun Young Lim

Se Il Oh

Provided is a high-durability coloring metal member. The high-durability coloring metal member includes a metal substrate, a dielectric layer provided on the metal substrate, and an oxynitride compound layer provided on the dielectric layer. The metal member is capable of expressing vivid and various colors with a color protection layer applied on the surface of the metal member.

High-durability coloring metal member and method of producing the same

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Method for manufacturing circuit board including metal-containing layer

According to one aspect of the present invention, a non-metal member having a colored surface is provided. The non-metal member having a colored surface includes a non-metal substrate; a metal coating layer disposed on the non-metal substrate; a light-transmissive dielectric layer disposed on the metal coating layer; and a color pattern structure disposed on the light-transmissive dielectric layer.

Non-metal member with colored surface and method of coloring non-metal surface

Provided is a coloring pattern structure. The coloring pattern structure includes: a substrate; a light-transmitting dielectric layer formed on at least one surface of the substrate; and a composite material layer disposed on an upper surface of the light-transmitting dielectric layer and formed of a metal and a first material not having a thermodynamic solid solubility in the metal, wherein the metal included in the composite material layer has a pattern coated only on portions of the upper surface of the light-transmitting dielectric layer, and the first material is coated on the remaining area where the metal is not coated.

Coloring pattern structure and method of manufacturing the same

A method of manufacturing a honeycomb metal structure includes providing a substrate comprising iron (Fe) and a container containing water; coating at least a part of the substrate with a viscid material whose viscidity is increased by moisture; attaching metal powder onto the viscid material; adhering the metal powder to the substrate due to an increase in viscidity of the viscid material by evaporating a portion of the water in the container and supplying moisture to the viscid material; and generating an uneven structure made of the metal powder bonded to the substrate by performing a heat treatment on the substrate to which the metal powder is adhered. The heat treatment may include performing a first heat treatment on the substrate to generate an intermetallic layer at an interface between the substrate and the metal powder; and performing a second heat treatment to dissolve the intermetallic compound layer.

Method of manufacturing a honeycomb metal structure using aluminum powder

A MoSi&#x2014;SiNcomposite coating which is coated on a surface of base materials. The MoSi&#x2014;SiNcomposite coating on the surface of the base material can be formed by forming a MoN diffusion layer by vapor-depositing of nitrogen on the surface of the base material and forming a MoSi&#x2014;SiNcomposite coating by vapor-depositing of silicon on the surface of the MoN diffusion layer, or the MoSi&#x2014;SiNcomposite coating on the surface of the base material can be formed by forming a MoSidiffusion layer by vapor-depositing of silicon on a surface of a base material by the CVD method, transforming the MoSidiffusion layer into a MoSidiffusion layer by heating under a high-purity hydrogen or argon atmosphere, forming a MoSi&#x2014;SiNcomposite diffusion layer by vapor-depositing of nitrogen on the surface of the MosSidiffusion layer by the CVD method and forming a MoSi&#x2014;SiNcomposite coating by vapor-depositing of silicon on the surface of the MoSi&#x2014;SiNcomposite diffusion layer.

[object Object]

Disclosed are a structure of multi-layered clad plates and sheets for corrosion resistance and a fabricating method thereof. Provided are clad plates and sheets for corrosion resistance in which Ni, Co, Ti, Nb, V, and Zr having an excellent corrosion resistance, or an alloy thereof are bonded to cheap Fe, Cu, or an alloy thereof. Chemical compositions of the clad metals and structures of the clad plates and sheets are easily modified with service conditions of the clad plates and sheets. Also, this invention provides a more cost-effective method based on a resistance seam welding process for fabricating the corrosion-resistant clad plates and sheets.

Clad plates for corrosion resistance and fabricating method thereof

A Mg&mdash;Ca sacrificial anode according to the present invention is disclosed, which is capable of providing a melts protection effect during a dissolution of Mg by adding Ca, which is a low melting point modification element, to Mg and obtaining characteristics which are equal to or better than a conventional Mg alloy group sacrificial anode in view of an open circuit potential and an anode efficiency.

Mg-Ca sacrificial anode

The present invention provides a thixoformable Al alloy composites wherein Si is added to ASTM 2000 series aluminum alloy so that the total Si content thereof may be 1-5 at. % and also a manufacturing method of thixoformable Al alloy composites comprising: obtaining a matrix of the composite containing 1-5 at. % of the total Si content by adding Si to ASTM 2000 series aluminum alloy; holding the matrix in the temperature range of 560-610.degree. C. to obtain a liquid fraction of 40-70% and thereafter performing a thixoforming process.

Thixoformable SiC/2xxx Al composites

Growing community of inventors

Seoul, South Korea

Ji Young Byun