Lg Chem, Ltd

Ji Yoon Woo

Choong Hoon Lee

Hyo Ju Kim

Sung Ho Choi

Jin Sam Gong

Sang Eun Park

Young Woo Lee

Hae Woong Park

Ik Je Choe

In Sung Park

Seung Hwan Jung

Sang Wook Han

Ki Eun Kim

The present invention relates to an olefin-based polymer satisfying requirements: (1) a melt index (MI, 190° C., 2.16 kg load conditions) ranging from 1.0 to 10.0 g/10 min; (2) a density (d) ranging from 0.875 to 0.895 g/cc; (3) 0.5 J/g≤dH(100)≤3.0 J/g and 1.0 J/g≤dH(90)≤6.0 J/g as measured by successive self-nucleation/annealing (SSA) using a differential scanning calorimeter (DSC); (4) 15≤T(90)−T(50)≤30 and 50° C.≤T(50)≤75° C. as measured by SSA using a DSC; and (5) a melting point (Tm) of 55° C.≤Tm≤80° C. as measured using a DSC. The olefin-based polymer according to the present invention is a low-density olefin-based polymer and has a highly crystalline region introduced therein, thereby exhibiting high mechanical stiffness.

Olefin-based polymer

The present invention provides an olefin-based polymer which satisfies the following conditions of (1) to (4) and is capable of exhibiting improved impact strength without degrading mechanical properties such as tensile strength: (1) density (d): from 0.850 to 0.910 g/cc, (2) melting index (MI, 190&#xb0; C., 2.16 kg load conditions): from 0.1 to 100 g/10 min, (3) molecular weight distribution (MWD): from 1.5 to 3.0, and (4) two peaks are shown in a temperature range of &#x2212;20&#xb0; C. to 120&#xb0; C. when taking measurements of temperature rising elution fractionation (TREF), and a relation of T(90)&#x2212;T(50)&#x2265;60&#xb0; C. is satisfied (where T(90) is a temperature at which 90 wt % of the olefin-based polymer is eluted, and T(50) is a temperature at which 50 wt % of the olefin-based polymer is eluted).

The present invention provides a polypropylene-based composite material capable of exhibiting excellent strength properties and impact strength properties, particularly, markedly improved impact strength properties at a low temperature without using a separate additive by including (A) polypropylene, and (B) an olefin-based polymer which satisfies the conditions of the following (b1) to (b4): (b1) density (d): from 0.850 to 0.910 g/cc, (b2) melt index (MI, 190&#xb0; C., 2.16 kg load conditions): from 0.1 g/10 min to 100 g/10 min, (b3) molecular weight distribution (MWD): from 1.5 to 3.0, and (b4) i) two peaks are shown in a temperature range of &#x2212;20&#xb0; C. to 120&#xb0; C. when taking measurements of temperature rising elution fractionation, and ii) a relation of T(90)&#x2212;T(50)&#x2265;60&#xb0; C. is satisfied (where T(90) is a temperature at which 90 wt % of the olefin-based polymer is eluted, and T(50) is a temperature at which 50 wt % of the olefin-based polymer is eluted).

Polypropylene-based composite material

The present invention relates to an olefin-based polymer exhibiting a single peak when analyzed by gel permeation chromatography (GPC), and having three elution temperatures Te1, Te2 and Te3 when measuring temperature rising elution fractionation (TREF) at a temperature ranging from &#x2212;20&#xb0; C. to 120&#xb0; C. Accordingly, the olefin-based polymer having excellent mechanical strength, and in particular, significantly improved impact strength is provided.

Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.

Encapsulant film

An encapsulant film and an optoelectronic device are provided. The encapsulant film having improved thermal resistance, and excellent adhesion, especially, long-term adhesive properties, to a front substrate and a back sheet can be provided. Also, the optoelectronic device capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated by the encapsulant film can be provided.

Provided are a polyolefin resin having two crystallization temperatures, a resin composition including the polyolefin resin, an encapsulant film, a method for manufacturing the encapsulant for an optoelectronic device, and an optoelectronic device, in which the encapsulant having high light transmittance and low haze value can be provided even under the condition of low lamination, and the resin composition including the polyolefin resin can be used for manufacturing various encapsulants for an optoelectronic device, thereby providing excellent adhesive strength with the front substrate and back sheet included in the device, especially, a long-term adhesion property and improved heat resistance.

Olefin resin

A copolymer, a method of manufacturing a copolymer, an encapsulant for optoelectronic devices, and an optoelectronic device are provided. The encapsulant exhibiting excellent adhesion to front substrates and back sheets included in various optoelectronic devices can be provided. Also, the encapsulant capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated in the optoelectronic device can be provided.

Growing community of inventors

Daejeon, South Korea

Ji Yoon Woo