Samsung Electronics Co., Ltd.

Ji-Yong You

Sa-Yoon Kang

Hyun-seok Lim

Jun-Young Jang

Jin-Hyuk Lee

Hye-Soo Shin

Dae-Joung Kim

Do-Yul Yoo

Dong-Whee Kwon

Joon-Sung Kim

Joong-Sung Kim

Hyung-Joo Youn

Provided is a substrate having an alignment mark, methods of aligning wafers and fabricating semiconductors. An alignment method of a wafer comprises providing a wafer on a wafer stage of a photolithography apparatus, irradiating light to the alignment mark, collecting reflected light from the alignment mark, analyzing optical information of the collected light, and determining a location of the wafer based on the analyzed optical information, wherein the wafer comprises a first surface having an alignment mark, the alignment mark including a first plurality of alignment patterns in a first row, and a second plurality of alignment patterns in a second row, the second plurality of alignment patterns being adjacent to the first plurality of alignment patterns, wherein the first plurality of alignment patterns are arranged in a row direction at a first pitch, and the second plurality of alignment patterns are arranged in the row direction at a second pitch different from the first pitch.

Substrate including alignment marks, methods of aligning wafers and fabricating semiconductors

An overlay mark may include a main overlay pattern and an auxiliary overlay pattern, wherein the main overlay pattern may have an opening exposing a substrate and the auxiliary overlay pattern may be formed in the opening. The auxiliary overlay pattern may be spaced apart from a sidewall of the main overlay pattern defining the opening. The thickness ratio of the auxiliary overlay pattern to the main overlay pattern may be about 0.05:1 to about 0.30:1. Accordingly, overlay accuracy measurements may be improved using the clearer overlay mark according to example embodiments.

Overlay mark and method of forming the same

Provided are a photomask and a method of fabricating a semiconductor device. The photomask includes a photomask substrate including a chip region and a scribe lane region, with an overlay mark formed in the scribe lane region. The overlay mark includes one or more sub-overlay marks. Each of the sub-overlay marks includes a plurality of unit regions sequentially connected to each other and having different widths, where the width of a given unit region is constant.

Photomask with overlay mark and method of fabricating semiconductor device

The alignment marks formed in a scribe line of a semiconductor substrate include at least one main mark, a first sub-mark and second sub-marks. The first sub-mark is formed at a central portion of the main mark. The second sub-marks are disposed symmetrically with respect to the first sub-mark and are used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main mark and the first sub-mark, and by measuring respective side edges between the main mark and each of the second sub-marks. Alternatively, the alignment marks include main outer and inner marks and a sub-mark disposed in between the main outer and inner marks. In this case, the sub-mark is used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main outer mark and the sub-mark, and by measuring respective side edges between the main inner mark and the sub-mark. Thus, accurate alignment information can be obtained regardless of whether the main mark was inadvertently formed as asymmetrical.

Substrate having alignment marks and method of obtaining alignment information using the same

A semiconductor device for reinforcing a substructure of a bond pad and a method for fabricating the same are provided. According to an embodiment, a semiconductor device for reinforcing a substructure of a bond pad comprises a semiconductor substrate and a substructure formed on the semiconductor substrate. The semiconductor device further includes an interlevel dielectric layer formed on the substructure. The interlevel dielectric layer includes a contact opening formed therein. The contact opening comprises a plurality of separate dots connected to each other. A contact plug is formed in the contact opening.

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Suwon-si, South Korea

Ji-Yong You