Samsung Electronics Co., Ltd.

Ji-yong Kim

Yu-Sung Kim

Chung-Hyun Ryu

Myung-ryul Jang

Su-in Kim

Sung-Ki Lee

So-Young Jung

Teck-su Oh

Chung Hyun Ryu

Jin Wook Song

Kyung-Suk Kim

A solid state drive apparatus includes a housing having an inner space and a plurality of vent channels penetrating a first side wall at a first side of the housing and a connector opening penetrating a second side wall at a second side of the housing opposite the first side of the housing, and a package substrate module in the inner space and having a package base substrate and a plurality of semiconductor chips mounted on the package base substrate. Each of the plurality of vent channels extends inwardly from an outer surface of the first side wall to an inner surface of the first side wall such that a vertical level of at least a portion of each of the plurality of vent channels varies between the outer surface and the inner surface.

Solid state drive apparatus and data storage system having the same

A solid state drive (SSD) apparatus includes a body including a base plate and a sidewall extending along a periphery of the base plate, the sidewall including an upper sidewall protruding from an upper surface of the base plate and a lower sidewall protruding from a lower surface of the base plate, a first package substrate module housed in an area defined by the upper surface of the base plate and the upper sidewall, and a second package substrate module housed in an area defined by the lower surface of the base plate and the lower sidewall, wherein a height of the upper sidewall is greater than a height of the lower sidewall.

Solid state drive apparatus

A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

Semiconductor support frame and storage device having the same

A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.

Heat sink and memory module having the same

Growing community of inventors

Suwon-si, South Korea

Ji-yong Kim