Samsung Electronics Co., Ltd.

Ji-Woong Sue

Jin-kyu Park

Joo-Hee Jang

Young-Kwan Park

Ho-Joon Lee

Jeong-Gi Jin

Seung-mo Kim

Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.

Semiconductor device, semiconductor package, and electronic system

An example embodiment relates to a semiconductor memory device including a plurality of cylindrical bottom electrodes arranged in a first direction and in a second direction. The device includes a supporting base configured to support the plurality of cylindrical bottom electrodes by contacting side surfaces of the plurality of cylindrical bottom electrodes. The supporting base includes first patterns in which first open areas are formed, and second patterns in which second open areas are formed. The first patterns and the second patterns have different oriented shapes.

Semiconductor memory device having capacitor and semiconductor device

Growing community of inventors

Yongin-si, South Korea

Ji-Woong Sue