Samsung Electronics Co., Ltd.

Korea Institute of Science and Technology

Ji-Won You

Min Cheol Park

Sang-Soo Lee

Heesuk Kim

Phillip Lee

Jeong Gon Son

Jong Hyuk Park

Sam-jong Choi

Sue-ryeon Kim

Jong-soo Kim

Young Mo Lee

Tae-hyoung Koo

Hyun-hee Ju

Cheong-jun Kim

A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

Polymer-hybrid carbon filler composite and method for preparing the same

A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.

Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer

Growing community of inventors

Seoul, South Korea

Ji-Won You