Samsung Electronics Co., Ltd.

Ji-sun Hong

Tae-Je Cho

Hyung-Sun Jang

Hyuek-Jae Lee

Eun-Mi Kim

Jong-Yun Myung

Hyun Yeul Lee

Young-Min Kim

Jung-Hwan Kim

Un-Byoung Kang

Jung-Woo Kim

Tae-Hong Min

Hyun-ki Kim

Jong-bo Shim

Min-Ok Na

Hyo-Chang Ryu

Su-jung Hyung

Jin-gyu Kim

Young-Bok Kim

Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB

A package-on-package assembly includes first and second packages and an adhesion member positioned between the first and second packages and adhering the first and second packages to one another. The first package may include a first substrate having a first surface and a second surface facing each other and including a land pad formed on the first surface, a first semiconductor chip formed on the first surface, and a first encapsulant member encapsulating the first surface and the first semiconductor chip and including a through-via spaced apart from the first semiconductor chip and exposing the land pad and a trench formed between the first semiconductor chip and the through-via, and wherein at least a portion of the trench is filled with adhesion member material.

Package-on-package assembly including adhesive containment element

A method of forming a semiconductor device includes preparing a semiconductor substrate having a plurality of chips formed thereon and a scribe lane disposed between the chips, simultaneously forming a groove having a first depth in the scribe lane, and a through hole penetrating the chips and having a second depth. The chips are separated along the groove. The first depth is smaller than the second depth.

Method of forming semiconductor device

A method of packaging a semiconductor device may include providing a semiconductor substrate including first and second spaced apart semiconductor chip areas, and adhering a cover on the first and second spaced apart semiconductor chip areas of the semiconductor substrate. A scribe line may be formed through the semiconductor substrate between the first and second semiconductor chip areas with a semiconductor bridge pattern remaining connected between the first and second spaced apart semiconductor chip areas after forming the scribe line. The cover and the semiconductor bridge pattern may then be cut after forming the scribe line.

Methods of packaging semiconductor devices including bridge patterns

Growing community of inventors

Asan-si, South Korea

Ji-sun Hong