Semes Co., Ltd.

Ji Su Hong

Sun Mi Kim

Pil Kyun Heo

Kuk Saeng Kim

Jung Suk Goh

Cheng Bin Cui

Oh Jin Kwon

Sang Hyun Son

Jae Myoung Lee

Yong-Jun Seo

Dong Ok Ahn

Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

Surface treatment method

Surface treatment apparatus and surface treatment method

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

Wafer type sensor unit and data acquisition method using the wafer type sensor unit

A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

Apparatus and method for processing substrate

Growing community of inventors

Chungcheongnam-do, South Korea

Ji Su Hong