Boe Technology Group Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Ji Shao

Jun Xu

Qing Zhang

Xiaojun Wang

Dapeng Liu

Shouzheng Wu

Baoqing Yin

Zhigang Ouyang

Fusheng Huang

Heng Zhang

Tongmin Liu

Haozhi Niu

The present disclosure provides a dimmer and a manufacturing method thereof, a backlight unit and a display device. The dimmer includes at least one brightness adjusting unit. Each brightness adjusting unit includes a reflective layer and an electrochromic layer stacked over each other, and the electrochromic layer is configured to be reversibly switchable between a transparent state and a color rendering state.

Dimmer, manufacturing method thereof, backlight unit and display device

A package structure of an organic light emitting diode display panel includes a display substrate, a glass cover plate and a package portion. The display substrate and the glass cover are arranged opposite to each other. The package portion is provided between a non-display region of the display substrate and a portion of the glass cover plate corresponding to the non-display region. The display substrate includes organic light emitting diode elements. The organic light emitting diode elements are located in a sealed cavity enclosed by the display substrate, the glass cover plate and the package portion. The package portion includes a first concavo-convex structure provided at a surface of the display substrate facing the glass cover plate; a second concavo-convex structure provided at a surface of the glass cover plate close to the display substrate; and a package material is provided between the first concavo-convex structure and the second concavo-convex structure.

Encapsulating structure of organic light emitting diode display panel having concave-convex structure in encapsulating portion

A touch module and a manufacturing method thereof, and a touch screen are provided. The method of manufacturing a touch module includes: forming a composite electrode, a lead, and a lead pad each of which has a stacked structure of a transparent conductive layer and a metal layer on a substrate by one patterning process, the touch module including a touch area, and a peripheral area and a bonding area located at the periphery of the touch area, the composite electrode being formed in the touch area, the lead being formed in the peripheral area, and the lead pad being formed in the bonding area; forming a protective layer outside the touch area, and etching away the metal layer of the composite electrode to form a transparent touch electrode.

Method of manufacturing a touch module

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Beijing, China

Ji Shao