Sk on Co., Ltd.

Ji San Kim

Seo Roh Rhee

Hae Ryong Jeon

Yang Kyu Choi

Jong Chan Lee

Tak Kyung Yoo

Yun Kyung Min

A battery module including a cell stack including a plurality of battery cells that are stacked on top of one another, the plurality of battery cells including electrode leads, at least one bus bar structured to provide a plurality of through-slits into which the electrode leads are inserted, and a bus bar frame coupled to the at least one bus bar, the bus bar frame having a plurality of through-holes in which the electrode leads are disposed. Each of the through-slits may include a first guide portion structured to include a first space wider than a width of a corresponding through-slit for a corresponding electrode lead to be inserted toward the through-slit, and the bus bar frame may include a second guide portion structured to include a second space that extends from the first space and has a width wider than the first space.

Battery module

The present disclosure relates to a battery module, including a cell assembly including one or more battery cells and a busbar assembly electrically connecting the one or more battery cells, a module case including an opening part at least partially opened on one surface, and forming an accommodating space for accommodating the cell assembly therein through the opening part, a module cover coupled to the module case to close the opening part, and a filling part which is provided between an outside of the busbar assembly and the module case and includes an electrically insulating material, and an assembly method thereof.

Battery module and assembly method thereof

Provided is a battery assembly including: a battery housing; a battery cell assembly including a plurality of battery cells which are stacked and placed in the housing and are electrically connected; and a heat dissipation resin layer, and the battery assembly has minimized cell damage due to a swelling phenomenon occurring in a battery cell and an improved module life by controlling the physical properties of the low-hardness heat dissipation resin layer.

Growing community of inventors

Daejeon, South Korea

Ji San Kim