Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Ji-nyeong Yun

Jae-Hong Kim

Jun-Bo Yoon

Seung-hwan Kim

Yong-hoon Yoon

Duke Kimm

Chang-keun Kim

In-kyu Park

Min-woo Rhee

Dong-uk Kwon

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Probe card, test apparatus including the probe card, and related methods of manufacturing

Growing community of inventors

Yongin-si, South Korea

Ji-nyeong Yun