Alti-electronics Co., Ltd

Alti-electronic Co., Ltd

Ji-Na Lee

Sun-Hong Kim

Min-Sik Kim

Jin-Won Lee

Kyoung-Il Park

Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

Growing community of inventors

Siheung-si, South Korea

Ji-Na Lee