Hynix Semiconductor Inc.

Ji Mook Kim

Hee Bok Kang

The LED package comprising a substrate and a display device, stacked on the substrate, including a light emitting diode (LED), and so on. A light emitting diode (LED) package comprises a LED device configured to emit light, an electrostatic discharge (ESD) device including an ESD circuit formed under the LED device, a printed circuit board (PCB), including a power supply line, formed under the ESD device, and a heat sink substrate, formed under the PCB, configured to release a heat delivered from the LED device through the ESD device and PCB.

Growing community of inventors

Cheongju, South Korea

Ji Mook Kim