Hon Hai Precision Industry Co., Ltd.

Ji Li

Terrance F Little

An-Jen Yang

Jim Xin Zhao

Yuan-Chieh Lin

Jie Zheng

Jun-Bin Huang

Gang Paul Chen

An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Opto-electronic device assembly

Growing community of inventors

West Covina, CA, United States of America

Ji Li