Taiwan Semiconductor Manufacturing Comp. Ltd.

Ji James Cui

Liang-Guang Chen

Chih Hung Chen

Kei-Wei Chen

Chun-Chieh Lin

Hsin-Ying Ho

Fu-Ming Huang

Kao-Feng Liao

Peng-Chung Jangjian

Ting-Hsun Chang

Chun-Wen Hsiao

Sheng-Chao Chuang

Michael Yen

Chyi Shyuan Chern

Keith Kuang-Kuo Koai

Feng Yuan Hsu

Tzu Kai Lin

Chia-Hsun Chang

A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Chemical mechanical planarization tool

The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.

Wet chemical heating system and a method of chemical mechanical polishing

A polishing pad for CMP is provided. The polishing pad includes a layer of material having a surface, a plurality of grooves indented into the surface in the layer of material, and a fluorescent indicator in the layer of material. Each of the plurality of grooves has a first depth, the fluorescent indicator has a second depth, and the second depth is equal to or less than the first depth.

Apparatus and methods for chemical mechanical polishing

Growing community of inventors

Hsinchu, Taiwan

Ji James Cui