Lg Innotek Co., Ltd.

Ji Hyeon Baik

Geun Ho Kim

Jae Hoo Jung

An embodiment discloses an electronic component package comprising: a housing including a flow path arranged on one surface thereof; and an inlet and an outlet arranged on the housing, wherein the flow path includes a first area connected with the inlet and a second area connected with the outlet, the first area includes a guide, and the guide includes an area of which the width gradually widens from the inlet.

Electronic component package

A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.

Converter

Disclosed is an electronic component case which includes a case body in which a rotationally engaging boss and a rotation prevention protrusion are disposed; and a bracket having a bracket body and an engaging portion formed at an end portion of the bracket body, wherein the engaging portion includes a rotationally engaging hole aligned with the rotationally engaging boss and a rotation prevention portion formed to be spaced apart from the rotationally engaging hole to form a contacting surface that is caught by the rotation prevention protrusion, and provides an advantageous effect of preventing the bracket from rotating in a process of tightening a screw to the bracket.

Growing community of inventors

Seoul, South Korea

Ji Hyeon Baik