Samsung Electronics Co., Ltd.

Ji-Hwang Kim

Sang-Wook Park

Cha-Jea Jo

Hae-Jung Yu

Jong-youn Kim

Teak-Hoon Lee

Young-Kun Jee

Kyung-Suk Oh

A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip.

Semiconductor packages having TSV and adhesive layer

A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.

Method of fabricating semiconductor device including a substrate attached to a carrier

Growing community of inventors

Bucheon-si, South Korea

Ji-Hwang Kim