Samsung Electro-mechanics Co., Ltd.

Ji Hwan Shin

Gyu Man Hwang

Ki Pyo Hong

Young Bok Yoon

Soo Cheol Lim

Chuel Jin Park

Yong Soo Oh

Il Jin Park

Jun Sung Lee

Byeung Gyu Chang

Se Hyung Lee

Joong Won Park

Seung Gyo Jeong

Jae Ho Moon

Seok Hee Lee

Dae Geon Seo

Young Ho Cho

A coil electronic component includes a body including a coil portion therein, and including a plurality of magnetic particles including an Fe-based alloy component, and an external electrode connected to the coil portion, wherein at least a portion of the plurality of magnetic particles include a first layer formed on a surface, and a second layer formed on a surface of the first layer, wherein the first layer includes an Fe oxide component and has a thickness of 10 nm or less.

Coil electronic component

A substrate and a method for manufacturing the same, and a probe card employing the substrate as a space transformer. The substrate includes: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. The recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mechanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card including the same.

Substrate and method for manufacturing the same, and probe card

There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Method of manufacturing multi-layer ceramic condenser

Provided is a shutter device including a coil layer that includes one or more substrates having a through-hole formed in the center thereof and a coil installed thereon, the coil generating a magnetic field when a current is applied; and a shutter layer that is installed on one surface of the coil layer and includes a shutter case having a shape corresponding to the substrate and a pair of shutter blades which are connected to flexible suspensions formed in the shutter case, respectively. The shutter blades open and close the through-hole of the substrate, while being moved in the reverse direction to each other by an electromagnetic force caused by an interaction with the magnetic field generated by the coil and returning to the original position due to the recovery force of the flexible suspensions when the electromagnetic force is canceled.

Shutter device

Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.

Dual band coupler

In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Method and device for sealing ceramic package of saw filter

Growing community of inventors

Gyeonggi-do, South Korea

Ji Hwan Shin