Hanwha Techwin Co., Ltd.

Hanwha Precision Machinery Co., Ltd.

Ji Hwan Bae

Sung Chan Jung

Yong Hyun Lee

Woon Do Jung

Tae Woo Kang

Provided are a bonding apparatus and a method of controlling the bonding apparatus. The bonding apparatus includes a bonding head, a wafer chuck configured to receive a wafer thereon, and at least one bonding stage cover disposed above the wafer chuck.

Bonding apparatus and method of controlling the same

A camera, including a lens assembly and a plurality of infrared ray (IR) light sources arranged around the lens assembly, has a photographing target area classified as a main irradiation area and an external irradiation area. The main irradiation area is set not to exceed a half-power angle of the IR light sources. The external irradiation area is set to exceed the half-power angle of the IR light sources. A reflector is installed corresponding to the IR light sources. IRs reflected by the reflector reach the external irradiation area.

Camera having infrared ray reflector

Provided is a camera used both outdoors and indoors and including a camera assembly, which is an indoor camera, a camera external package coupled to the indoor camera, and an outdoor camera, which is a camera used outdoors. The outdoor camera is formed by coupling the camera assembly and the camera external package. It is possible to extend functions of the camera assembly by coupling the camera assembly and the camera external package. Functions of using power over Ethernet (PoE) power, adding a video analytics (VA) function, being used outdoors, and the like are examples of such extended functions. Since the outdoor camera is provided with a configuration for coupling the camera assembly and the camera external package, it is unnecessary to separately provide a camera used indoors and a camera used outdoors. Also, it is possible to maintain a small size of the camera assembly adequate for being used both indoors and outdoors.

Growing community of inventors

Changwon-si, South Korea

Ji Hwan Bae