Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Samsung Electronics Co., Ltd.

Ji Hun Lee

Won Chul Do

Doo Hyun Park

Jin Han Kim

Dong Jin Kim

Jong Sik Paek

Seong Min Seo

Se Woong Cha

Hye Jin Kim

Yeong Beom Ko

Myoung Soo Park

Joon Dong Kim

Jung Woo Shin

Joon Hwan Kim

Jeong Won Ko

Han Ju Cho

Mun Hwi Kim

Kyung Wook Ro

Do Hyung Kim

Curtis Michael Zwenger

Jun Hwan Park

Hyun Cho

Won Myoung Ki

Seung Nam Son

Dong Hoon Han

David Jon Hiner

Jae Hun Bae

Young Rae Kim

Ronald Patrick Huemoeller

Michael G Kelly

Min Hwa Chang

Wang Gu Lee

Mi Kyeong Choi

Dong Hyun Kim

Jin Ryang Hwang

Jin Young Khim

Seo Yeon Ahn

Ju Hong Shin

Suresh Jayaraman

Seok Woo Yun

Kye Ryung Kim

Jae Yoon Kim

Won Chul Do Do

Jae Hun Bae Bae

Disclosed is an electronic device that includes a display that outputs execution screens of a plurality of applications, a memory that stores the plurality of applications, and a processor electrically connected with the display and the memory. The processor retrieves a history of one or more applications among the plurality of applications that were previously executed in the electronic device, in response to a user input detected by the electronic device and outputs the history on the display based on information about the one or more applications and information about layouts of execution screens of the one or more applications. If at least one of the one or more applications is selected from the history, the processor outputs an execution screen of the selected application on the display according to the corresponding layout.

Electronic device and method for displaying history of executed application thereof

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Package-on-package type semiconductor package

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Semiconductor device and manufacturing method thereof

In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Semiconductor devices and methods of manufacturing semiconductor devices

Method of manufacturing a package-on-package type semiconductor package

Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer.

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Growing community of inventors

Gwangju-si, South Korea

Ji Hun Lee