Samsung Electronics Co., Ltd.

Dongwoo Fine-chem

Ji-Hoon Jeong

Kun-Tack Lee

Jung-Min Oh

Hyo-San Lee

Yong-Sun Ko

Yong-Jhin Cho

In-Gi Kim

Sang-tae Kim

Byung-Kwon Cho

Yeon-Jin Gil

Kyong-ho Lee

Seong-min Kim

Yong-Myung Jun

Mi-Hyun Park

Na-Rim Kim

Young-Hoo Kim

Sang-Jine Park

Seok-Hoon Kim

Dong-Gyun Han

Il-Sang Lee

Jin-Suk Hong

Sang-won Bae

Sang-jine Park

Young-hoo Kim

A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Substrate processing apparatus and apparatus for manufacturing integrated circuit device

A method of processing substrates, comprising: loading a substrate into a process chamber; supplying a supercritical fluid, that is a process fluid under the supercritical state, into the process chamber, chemicals separated from the substrate and the supercritical fluid being mixed into a supercritical mixture in the process chamber; and gradually decreasing a chemical concentration of the supercritical mixture by alternately repeating a pressure drop mode and a supplemental mode such that the supercritical mixture partially flows out from the process chamber at the pressure drop mode when an inner pressure of the process chamber reaches a first pressure and the supercritical fluid turbulently flows into the process chamber at the supplemental mode when the inner pressure of the process chamber reaches a second pressure that is smaller than the first pressure and over a supercritical pressure of the process fluid.

Method of removing chemicals from a substrate

A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.

Compositions for removing photoresist

A method of processing substrates, comprising: loading a substrate into a process chamber; supplying a supercritical fluid, that is a process fluid under a supercritical state, into the process chamber, chemicals separated from the substrate and the supercritical fluid being mixed into a supercritical mixture in the process chamber; and gradually decreasing a chemical concentration of the supercritical mixture by alternately repeating a pressure drop mode and a supplemental mode such that the supercritical mixture partially flows out from the process chamber at the pressure drop mode when an inner pressure of the process chamber reaches a first pressure and the supercritical fluid turbulently flows into the process chamber at the supplemental mode when the inner pressure of the process chamber reaches a second pressure that is smaller than the first pressure and over a supercritical pressure of the process fluid.

Method of treating substrates using supercritical fluids

A source supplier includes a source reservoir that contains a liquefied source fluid for a supercritical process, a vaporizer that vaporizes the liquefied source fluid into a gaseous source fluid under high pressure, a purifier that removes organic impurities and moistures from the gaseous source fluid and an analyzer connected to the purifier that analyzes an impurity fraction and a moisture fraction in the gaseous source fluid. Moisture and organic impurities are removed from the source fluid to reduce the moisture concentration of the supercritical fluid in the supercritical process.

Source supplier for a supercritical fluid, substrate processing apparatus having the same

Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.

Apparatus for treating substrates using supercritical fluids, substrate treatment system including the same and method of treating substrates using the same

Methods of manufacturing semiconductor devices using a composition for removing photoresist and methods of removing photoresist from a semiconductor substrate

A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.

Sealing member and substrate processing apparatus including the same

A cleaning solution composition includes an organic solvent in which a metal fluoride does not dissolve, at least one fluoride compound that generates bifluoride (HF), and deionized water, wherein the deionized water may be included in a concentration of 1.5 wt % or lower based on the total weight of the cleaning solution composition.

Cleaning solution composition and method of cleaning semiconductor device using the same

An abnormal condition detection circuit, an integrated circuit (IC) card having a central processing unit (CPU), and a method of operating the CPU, allow the CPU to be reset when an abnormal condition is detected in the IC card. The IC card includes the CPU, a non-volatile memory, an abnormal condition detection circuit, and a reset signal generator. The IC card includes detectors that detect a corresponding abnormal condition in the IC card, and an enable signal generation circuit that generates a reset enable signal and an interrupt enable signal in response to an interrupt control signal and a detection signal output from at least one of the detectors. The reset signal generator generates a reset signal in response to the reset enable signal. The CPU is reset in response to the reset signal and interrupted in response to the interrupt enable signal.

Abnormal condition detection circuit, integrated circuit card having the circuit, and method of operating CPU

Growing community of inventors

Suwon-si, South Korea

Ji-Hoon Jeong