Samsung Electro-mechanics Co., Ltd.

Ji Hong Jo

Woo Chul Shin

Hyung Soon Kwon

Kyoung Jin Cha

Sang Soo Park

Hwi Dae Kim

Chan Young Yoon

Yong Jong Park

Jang Yeol Lee

Seok Kyoon Woo

Jong Ho Lee

Taek Jung Lee

Jin Kyung Joo

Myung Jun Park

Min Gon Lee

Du Won Choi

Kyung Sik Kim

Hyun Hee Gu

Hye Young Choi

Seung In Baik

Dong Yeong Kim

Jae Hyun Lee

Jae Young Na

Ki Pyo Hong

Yoo Jeong Lee

Jin Man Jung

Ki Jun Kim

Heung Kil Park

Sung Soo Kim

Beom Joon Cho

Se Hun Park

Seung Hun Han

Hyoung Uk Kim

Byeong Chan Kwon

Jin Hyung Lim

Tae Young Ham

Hun Gyu Park

Sung Hyung Kang

Hang Kyu Cho

Jin Mo Ahn

Chae Min Park

Jong Hyun Cho

In Tae Seo

Min Young Choi

Sang Roc Lee

Yong In Kim

Jae Shik Shim

Sea Hanna Doo

Hae Suk Chung

Jae Sung Park

Jeong Ryeol Kim

Je Jung Kim

Ho In Jun

Won Kuen Oh

Won Hee Yoo

Tae Gyeom Lee

Hye Hun Park

Ji Hee Moon

Gi Seok Jeong

Jae Hee Kim

Jeong Yun Park

Woo Chui Shin

Seon Young Yoo

Do Heung Na

Hye Won Ryoo

Ji Hea Kim

Seok Keun Ahn

A Reum Jun

Ji Hye Yu

Gwang Hyeon Park

Yu Bi Han

Jin Su Park

Jong Hoon Kim

Jae Yeol Choi

Myung Sam Kang

Jin Woo Lee

Jung Hyun Park

Yun Sung Kang

Do Young Jeong

Hee Sun Chun

Chang Sup Ryu

Tae Hyeok Kim

Sung Kwon An

Jin Soo Park

Seung Heui Lee

Hyun Sub Oh

Je Gwang Yoo

Jin Yong An

Shuhichi Okabe

Jeong Mo Kang

Min Seop Kim

Young Jun Cha

Seung Hyun Park

Sea Han Na Doo

Soon Oh Jung

Byung Gyun Kim

Woong Shin

Hyun Woo Seung

A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided, the dielectric ceramic composition includes a BaTiO-based base material main component and a subcomponent, wherein the subcomponent includes zinc oxide (ZnO) as a first subcomponent, and the content of the ZnO is 0.1 mol % or more and less than 0.4 mol % with respect to 100 mol % of the base material main component.

Dielectric ceramic composition and multilayer ceramic capacitor comprising same

A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.

Dielectric ceramic composition and multilayer ceramic capacitor comprising the same

A dielectric ceramic composition and a multilayer ceramic capacitor comprising the same are provided. The dielectric ceramic composition includes a BaTiO-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and cerium (Ce) as first accessory ingredients. A total content of Dy and Ce is greater than 0.25 mol % and equal to or less than 1.0 mol % based on 100 mol % of the base material main ingredient.

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Multilayer electronic component for enhanced moisture resistance and bending strength

A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Ceramic electronic component and method of manufacturing the same

A dielectric composition includes a main ingredient having a perovskite structure represented by ABO, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.

Dielectric composition and multilayered electronic component comprising the same

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba(1-x)Ca.)TiO3-(1-z)BaTi205 including a first main component represented by (Ba(1-x)Ca.)TiO3 and a second main component represented by BaTi2O5, 0.7z0.8 and 0≤x<0.1.

Multilayer ceramic electronic component

A method of manufacturing a multilayer capacitor includes preparing a guide frame, forming at least one dielectric layer between at least two surfaces of the guide frame such that at least a portion of each side surface of the at least one dielectric layer is in contact with the at least two surfaces, forming at least one internal electrode on an upper surface of the at least one dielectric layer between at least two surfaces of the guide frame using an inkjet printing method, and separating at least two surfaces of the guide frame from the at least one dielectric layer.

Method of manufacturing multilayer capacitor

An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.

Electronic component and board having the same mounted thereon

A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface of the body, and extending onto a portion of each of the third to sixth surfaces of the body; a second external electrode disposed on the second surface of the body and extending onto a portion of each of the third to sixth surfaces of the body; and an insulating layer disposed on the third to sixth surfaces of the body, and extending onto the first and second external electrodes, wherein in at least one of cross-sections in first and second directions and cross-sections in first and third directions, the insulating layer extends outwardly beyond the first and second surfaces of the body.

Ceramic electronic component including insulating layer

A method of manufacturing a multilayer ceramic electronic component includes: preparing a dielectric magnetic composition including base material powder particles including BaTiOor (BaCa)TiO(0≤x≤0.1), the base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheets using dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets to which the internal electrode paste is applied; and preparing a ceramic body including dielectric layers and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed therebetween by sintering the green sheet laminate.

Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component

A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on a portion of the first surface, and a third band portion on a portion of the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on a portion of the first surface, and a fourth band portion on a portion of the second surface, an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes an oxide containing Ba.

Multilayer electronic component

A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.

Ceramic electronic component with openings in electrode

A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and the upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.

Multilayer capacitor and substrate including the same mounted thereon

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; a cover layer disposed on the first and second connecting portions and disposed to cover the second surface and the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The cover layer includes a base layer, having hydrophilicity, and an insulating layer disposed on the base layer.

Multilayer electronic component and method of manufacturing the same

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Suwon-si, South Korea

Ji Hong Jo