Accton Technology Corporation

Ji-Hong Hsiao

Ming-Hsiu Wu

Wen-Hsiung Lin

Kun-Fang Wu

A wireless LAN antenna comprises a dielectric substrate having a first surface and a second surface. The first surface of the dielectric substrate has a rectangular loop. A rectangular grounding copper foil is adhered within the rectangular loop. A signal feeding copper foil is further included. One end of the signal feeding copper foil is connected to the rectangular loop and the grounding copper foil, while another end of the signal feeding copper foil running across another end of the rectangular loop. Moreover, a layer of back surface copper foil is plated to the back side of the printed circuit board. This back surface copper foil covers one half of the loop on the front surface. Adjustment of the transversal dimensions of the grounding copper foil will impedance-match the antenna to the feeding structure of the antenna.

Growing community of inventors

Taipei Hsien, Taiwan

Ji-Hong Hsiao