Samsung Electro-mechanics Co., Ltd.

Ji Hee Moon

Chae Min Park

Woo Chul Shin

Ki Won Kim

Yu Bi Han

Ji Hea Kim

Sang Soo Park

Ji Hong Jo

Ki Hwan Kim

Dong Hwi Shin

Sun Cheol Lee

Jae Yeol Choi

Doo Young Kim

Hyun Hee Gu

Hae Suk Chung

Mi Jin Park

Kyeong Jun Kim

Seung Heon Han

Jung Tae Park

Jin Hyung Lim

Byung Woo Jeon

Joon Hwan Kwag

Youn Sik Jin

Jang Hyun Lee

Seung Yul Lee

Hyoung Wook Lim

Han Eol Cho

Young Jun Choi

Tae Jin Jang

A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9&#x2264;A/BW&#x3c;1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by 'A', and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by 'BW'.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with the respective dielectric layers disposed therebetween, and first and second external electrodes disposed on first and second external surfaces of the ceramic body to be connected to corresponding internal electrodes, respectively. A longest distance from the first external electrode to the second external electrode is denoted by La, a shortest distance from the first external electrode to the second external electrode is denoted by Lb, and Lb/La is greater than zero to 0.6 or less.

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction thereof, and floating electrodes which are partially overlapped with the first and second internal electrodes; upper and lower cover parts including the dielectric layers and disposed above and below the active part; dummy electrodes disposed in the upper and lower cover parts to be overlapped with the floating electrodes; and first and second external electrodes.

Multilayer ceramic electronic component and board having the same

A multilayer ceramic electronic component includes a capacitance forming part in which a plurality of first and second dielectric layers are alternately disposed. The capacitance forming part includes first and second internal electrodes disposed to be spaced apart from each other. First floating electrodes are disposed to be spaced apart from the first and second internal electrodes on the plurality of first dielectric layers, and second floating electrodes are disposed on the plurality of second dielectric layers and partially overlap the first and second internal electrodes. The ceramic body further includes a protective part having a plurality of third dielectric layers on which first and second dummy electrodes are disposed and a plurality of third dummy electrodes are disposed between the first and second dummy electrodes.

Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.

Multilayer ceramic device

Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.

Chip device and method for manufacturing the same

Growing community of inventors

Suwon-si, South Korea

Ji Hee Moon