Samsung Electronics Co., Ltd.

Biospectrum, Inc.

Ji Eun Woo

Gun Goo Lee

Deok Hoon Park

Eun Sun Jung

Sung Keun Park

Seoung Woo Shin

Jun Gul Hwang

The present invention relates to a composition for preventing hair loss or promoting hair growth containing a milk thistle flower extract as an active ingredient. More specifically, the present invention relates to a cosmetic composition, pharmaceutical composition and food composition containing a milk thistle flower extract as an active ingredient, which are able to promote hair growth by inducing the proliferation of dermal papilla cells reduced due to senescence, and activate dermal papilla cells by inhibiting the senescence of dermal papilla cells through inhibition of the activity of senescence-associated β-galactosidase (SA-β-Gal) and the production of senescence-associated secretory phenotypes, thereby preventing hair loss or promoting hair. The composition according to the present invention has no skin irritation and cytotoxicity, and thus has excellent safety for the human body, and at the same time, is very effective in promoting the proliferation of dermal papilla cells and inhibiting the senescence of dermal papilla cells. Thus, it may be useful as an active ingredient in a cosmetic composition, a pharmaceutical composition or a food composition for preventing hair loss or promoting hair growth.

Composition for treating hair loss or promoting hair growth comprising milk thistle flower extract as an active ingredient

A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Semiconductor package

Growing community of inventors

Suwon-si, South Korea

Ji Eun Woo