Samsung Sdi Co., Inc.

Cheil Industries Inc.

Lotte Advanced Materials Co., Ltd.

Samsung Electronics Co., Ltd.

Ji-Eun Park

Young-Kook Kim

Chang-Min Hong

Doo-Han Ha

In-Chol Kim

Young-Sin Kim

Yun-Suk Choi

Seung-Hun Lee

Hyun-ah Kim

Jin-Ho Son

Ja-Yoon Kim

Won-yong Choi

Kyun-Ha Ban

Hee-Seok Na

Jeong-Ryeol Seo

Ki-Seok Choi

A thermoplastic resin composition includes (A) a first rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 100 nm and less than about 200 nm, (B) a second rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 200 nm and less than or equal to about 400 nm, (C) a first vinyl-based copolymer of an aromatic vinyl monomer and a unsaturated nitrile monomer, and (D) a second vinyl-based copolymer of an alkyl (meth)acrylate monomer, an aromatic vinyl monomer, and a unsaturated nitrile monomer. A molded article can be made using the same.

Thermoplastic resin composition and molded article using the same

Disclosed is a thermoplastic resin composition including: (A) a polycarbonate resin; (B) an acrylate-styrene-acrylonitrile (ASA) graft copolymer; (C) a random copolymer of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound; and (D) a copolymer of an aromatic methacrylate and a monofunctional unsaturated monomer.

Thermoplastic resin compositions and molded products including the same

Disclosed are an acrylic-based resin composition including (A) a first acrylic-based copolymer having a core-shell structure including a rubber having an average particle diameter of about 0.1 to about 0.30 &#x3bc;m, (B) a second acrylic-based copolymer having a core-shell structure including a rubber having an average particle diameter of about 0.35 to about 0.6 &#x3bc;m, (C) a vinyl-based copolymer, (D) an ultraviolet (UV) stabilizer, and (E) an UV absorber; and a molded product made using the same.

Acrylic based resin composition and molded product using the same

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Ji-Eun Park