Samsung Electronics Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Ji Eun Park

Mi Jin Park

Job Ha

Seung Kyu Kim

Gyeong Taek Lee

Shin Hyoung Kim

Kyung Min Park

Eun Jung Lee

Dong Hoon Kang

Hyeon Koon Myeong

Sim Chung Kang

Byeol Teo Park

Dong Jun Jung

Jong Lae Park

In Joo Kim

Dae Jin Shim

Hyun Sik Chae

Seung Mok Lee

Jong Dae Jung

Jin Hwa Jang

Hye Yun Jeong

Ji Yeon Park

A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cmto 600 cm. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is λ(cm), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is λ+0.75 cmor greater.

Multilayer electronic component

A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Semiconductor package including conductive crack preventing layer

Semiconductor package

A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.

A broadcast receiving for updating service map information by scanning the broadcast signal when signaling information included in a broadcast signal has been changed.

Broadcast receiving apparatus and control method thereof

A method of operating a CPU including a memory for storing a load tracker and a booster and a core for executing the load tracker and the booster includes determining, by the load tracker, whether an idle task is executed in the core, generating, by the load tracker, an event corresponding to a result of the determination, broadcasting, by the load tracker, a generated event to the booster, and setting, by the booster, a QoS minimum value of the core based on the event. The method of operating a CPU may further include registering, by the load tracker, an idle start worker callback and an idle end worker callback in an idle module when the CPU is initialized, and generating, by the load tracker, an idle start worker and an idle end worker when the CPU is initialized.

Method of operating CPU and method of operating system having the CPU

An application processor includes a first core and a second core. The first core is configured to implement a scheduler which monitors a workload of a task of the first core, and the first core is further configured to implement an idle checker which determines whether the second core is idle.

Application processor and system on chip

A method of localization and mapping of a mobile robot may reduce position errors in localization and mapping using a plurality of vector field sensors. The method includes acquiring a relative coordinate in a movement space using an encoder, acquiring an absolute coordinate in the movement space by detecting intensity and direction of a signal using vector field sensors, defining a plurality of virtual cells on a surface of the movement space such that each of the cells has a plurality of nodes having predetermined positions, and updating position information about the nodes of the cells based on the relative coordinate acquired through the encoder and the absolute coordinate acquired through the vector field sensors and implementing localization and mapping in the movement space in a manner that position information of a new node is estimated while position information of a previous node is determined.

Mobile robot and method of localization and mapping of the same

Growing community of inventors

Suwon-si, South Korea

Ji Eun Park