Lg Chem, Ltd

Ji Eun Myung

Seung Heon Lee

Jooyeon Kim

Yong Goo Son

Kiseok Lee

Chang Yoon Lim

Ji Young Hwang

Kwang Joo Lee

Han Min Seo

Jiehyun Seong

Sera Kim

Mun Seop Song

Hye Won Jeong

Kyungjun Kim

Bo Ra Shin

Boem Mo Koo

The present specification relates to a heating element and a method for manufacturing the same.

Method for manufacturing heating element

The present specification relates to an ink composition, a cured pattern prepared using an ink composition, a heating element including a cured pattern, and a method for manufacturing a heating element.

Ink composition, cured patterns produced thereby, heating element including same, and manufacturing method therefor

The present disclosure relates to a method for manufacturing a heating element, which includes the steps of: preparing a first bonding film; forming a conductive heating pattern on the first bonding film; and laminating a second bonding film and a transparent substrate on the first bonding film, where the second bonding film is disposed on a surface opposite to the surface provided with the conductive heating pattern of the first bonding film, and the conductive heating pattern is formed by using an adhesive film having an adhesive strength decrement of 30% or greater by an external stimulus based on adhesive strength before the external stimulus.

Heating element and manufacturing method therefor

Heating element

The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

Method of manufacturing circuit board

The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.

Laminated body comprising metal wire layer, and manufacturing method therefor

The present specification provides a blanket for printing and a method for manufacturing the same.

Blanket for printing and method for manufacturing same

The present specification relates to an offset printing composition, a printing method using the same, and a pattern including the offset printing composition.

Growing community of inventors

Daejeon, South Korea

Ji Eun Myung