Posco Led Company Ltd.

Ji Eun Kook

Dae Won Kim

Jung Hwa Kim

Seong Bok Yoon

Min Uk Yoo

Jing Jong Kim

Kyung-Rye Kim

An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Growing community of inventors

Yongin-si, South Korea

Ji Eun Kook