Industrial Technology Research Institute

Jhy-Long Jeng

Jinn-Shing King

Shur-Fen Liu

Jeng-Yu Tsai

Steve Lien-Chung Hsu

Chin-Ching Lin

Wen-Ching Sun

Yu-Chun Chen

Po-I Lee

A polyimide copolymer represented by formula (I) or formula (II) is provided.  In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.

Polyimide copolymers and method for fabricating patterned metal oxide layers

A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of Rand R, independently, is a Csaturated or an unsaturated carbon chain, Ris ether, phenyl, a Cheterocyclic or Csaturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Thermally curable solder resist composition

The present invention relates to a positive-working photosensitive composition comprising a partially diazonaphthoquinone (DNQ) capped polyamic ester with a capping level of about 5-80 molar %; a photosensitive agent and a solvent. The composition shows a high photosensitivity and leaves a relief pattern with high resolution and low dark film loss.

Positive working photosensitive composition, article and process for forming a relief pattern

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Jhy-Long Jeng