Taiwan Semiconductor Manufacturing Comp. Ltd.

Jhu-Min Song

Chien-Chih Chou

Kong-Beng Thei

Fu-Jier Fan

Yu-Chang Jong

Yi-Huan Chen

Alexander Kalnitsky

Kong-beng Thei

Szu-Hsien Liu

Huan-Chih Yuan

Szu-hsien Liu

Huan-chih Yuan

Ming Chyi Liu

Hsiao-Chin Tuan

Tsung-Chieh Tsai

Jhih-Bin Chen

Hung-Shu Huang

Yu-Lun Lu

Tsung-chieh Tsai

Yi-Kai Ciou

Hsiao-chin Tuan

A semiconductor device is provided. The semiconductor device includes a first die, a second die, a first through via, and a second through. The first die includes a first substrate, a first interconnection structure disposed on the first substrate, and a plurality of first bonding substructures over the first interconnect structure. The second die includes a second substrate, a second interconnect structure disposed on the second substrate, and a plurality of second bonding substructures over the second interconnect structure. The plurality of second bonding substructures are bonded to the plurality of first bonding substructures. The first through via and the second through via extend through the second substrate and to the second interconnect structure, wherein the first through via and the second through via are electrically disconnected to each other.

Semiconductor device

Interlayer dielectric (ILD) layer(s) of a semiconductor device may be configured as a gate oxide for high-voltage transistors, and therefore additional process operations to deposit dedicated gate oxide layers are not needed. Moreover, additional processing operations to form the gate structures of the high-voltage fin-based PMOS transistors and high-voltage fin-based NMOS transistors are not needed in that middle end of line (MEOL process and back end of line (BEOL) processes can be used as the gate formation process of the high-voltage transistors.

High-voltage semiconductor devices and methods of formation

A semiconductor structure includes a substrate, a first FET device and a second FET device. The substrate has a first region and a second region. The first FET device is in the first region, and the second FET device is in the second region. The first FET device includes a first isolation structure, a first gate electrode disposed over a portion of the first isolation structure, and a first gate dielectric layer between the substrate and the first gate electrode. The first gate dielectric layer has a first thickness. The second FET device includes a plurality of fin structures, a plurality of second isolation structures, a second gate electrode over the plurality of fin structures, and a second gate dielectric layer between the second gate electrode and the plurality of fin structures. The second gate dielectric layer has a second thickness. The second thickness is less than the first thickness.

Semiconductor structure and method for forming the same

A semiconductor structure and forming method thereof are provided. A substrate includes a region. A first gate structure and a sacrificial gate structure are recessed in the substrate and disposed in the region. The sacrificial gate structure is adjacent to the first gate structure. A first contact is electrically connected to the first gate structure. A sacrificial gate masking structure is disposed over the sacrificial gate structure. An upper surface of the sacrificial gate structure is entirely covered by the sacrificial gate masking structure.

Semiconductor structure and forming method thereof

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes: a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures formed in an array disposed over the gate electrode; and a second protection structure comprising a ring shape from a top-view perspective, and disposed over the gate dielectric layer and at a same level as the plurality of first protection structures from a cross-sectional view.

Semiconductor structure and method of forming the same

Some embodiments relate to an integrated chip structure. The integrated chip structure includes a substrate having a first device region and a second device region. A plurality of first transistor devices are disposed in the first device region and respectively include epitaxial source/drain regions disposed on opposing sides of a first gate structure. The epitaxial source/drain regions have an epitaxial material. A plurality of second transistor devices are disposed in the second device region and respectively include implanted source/drain regions disposed on opposing sides of a second gate structure. A dummy region includes one or more dummy structures. The one or more dummy structures have dummy epitaxial regions including the epitaxial material.

Checkerboard dummy design for epitaxial open ratio

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate having an isolation ring extending in the direction substantially parallel to the surface of the substrate, an active region over the substrate and laterally enclosed by the isolation ring, a seal ring structure over the substrate, the seal ring structure laterally enclosing the active region and including at least a wiring layer and at least a via layer, and an encapsulant material laterally enclosing the seal ring structure.

Semiconductor structure and manufacturing method of the same

A semiconductor structure and forming method thereof are provided. A substrate includes a first region, a second region, and a boundary region defined between the first region and the second region. An isolation structure is disposed in the boundary region. An upper surface of the isolation structure has a stepped profile. A first boundary dielectric layer and a second boundary dielectric layer are disposed over the isolation structure. The first boundary dielectric layer is substantially conformal with respect to the stepped profile of the isolation structure.

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate, a gate electrode, a gate dielectric layer, first protection structures, a second protection structure and an insulating layer. The gate electrode is disposed within the substrate. The gate dielectric layer is disposed within the substrate and laterally surrounds the gate electrode. The first protection structures are disposed over the gate electrode. The second protection structure is disposed over the gate dielectric layer. The insulating layer is between the second protection structure and the gate dielectric layer.

Semiconductor structure and method of forming thereof

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure disposed over the gate dielectric layer and contacting the gate dielectric layer; and a pair of source/drain regions on opposing sides of the gate dielectric layer.

A semiconductor device and a method for forming a semiconductor are provided. The semiconductor device includes: a first substrate, a first conductive line disposed on the first substrate, a second substrate opposite to the first substrate, a second conductive line disposed on the second substrate and adjacent to the first conductive line, and a plurality of bonding structures between the first conductive line and the second conductive line. The first conductive line includes a plurality of first segments separated from one another. The second conductive line includes a plurality of second segments separated from one another. Each of the bonding structures is connected to a respective first segment of the plurality of first segments and a respective second segment of the plurality of second segments such that the plurality of first segments, the plurality of bonding structures and the plurality of second segments are connected in series.

Semiconductor device and manufacturing method of the same

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure disposed over the gate dielectric layer; and a pair of source/drain regions on opposing sides of the gate dielectric layer.

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a well region extending in a first direction; a gate electrode disposed within the substrate and overlapping the well region; a gate dielectric layer disposed within the substrate and laterally surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure extending in a second direction different from the first direction over the gate dielectric layer; and an insulating layer extending in the second direction between the second protection structure and the gate dielectric layer.

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Nantou County, Taiwan

Jhu-Min Song