Taiwan Semiconductor Manufacturing Comp. Ltd.

Jhao-Yi Wang

Wen-Hsiung Lu

Chin-Yu Ku

Ming-Da Cheng

Ting-Li Yang

Lung-Kai Mao

Fu Wei Liu

A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Method of forming semiconductor device having at least one via including concave portions on sidewall

A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an opening, which penetrates through the supporting substrate and stops on the bonding layer. The opening has substantially straight edges. The bonding layer is then etched. A second etching process is performed to extend the opening down into the semiconductor substrate. A bottom portion of the opening is curved.

Arched membrane structure for MEMS device

Semiconductor device having at least one via including concave portions on sidewall

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Tainan, Taiwan

Jhao-Yi Wang