Lg Innotek Co., Ltd.

Jeung Ook Park

Sung Guk Lee

Jae Man Park

Hyun Gu Im

Jong Heum Yoon

Sang In Yoon

In Hee Cho

Young Bae Jang

Jin Gyeong Park

Jeong Han Kim

Ji Hwan Jeon

Jong Sik Lee

Sung Jin Yun

Chan Joong Kim

Jung Ho Kim

Jong Min Lee

Jin Hwan Kim

Hyuk Soo Lee

Hyun Gyu Park

Sang Hun An

Myeong Jeong Kim

Byung Sook Kim

Eun Jin Kim

Yong Sang Cho

Moo Seong Kim

Hae Yeon Kim

Sang A Ju

Seung Hyeon Jeong

Yeo Eun Yoon

Sung Bae Moon

Gun Young Gil

Thanh Kieu Giang

Geon Young Kil

A camera actuator according to an embodiment includes a base; a rail guide part coupled to the base; a first lens assembly coupled to the base and fixed; and second and third lens assemblies disposed in the base and moving along the rail guide part, wherein the base includes a coupling protrusion and a base recess adjacent to the coupling protrusion; and at least one of the rail guide part and the first lens assembly includes a coupling hole corresponding to the coupling protrusion of the base.

Camera actuator and camera module including same

An embodiment of the present invention discloses a camera actuator comprising: a housing; a mover disposed in the housing and including protrusions on one surface which protrude toward the housing; and a driving unit disposed in the housing and rotating the mover on the basis of a first direction or a second direction perpendicular to the first direction, wherein the protrusions comprise: a first protrusion disposed on the one surface; a second protrusion spaced apart from the first protrusion; and a third protrusion separated from the first protrusion by a distance greater than from the second protrusion, and wherein the housing comprises: a groove in which the first protrusion is seated on an inner surface corresponding to the one surface; a first hole through which the second protrusion passes; and a second hole through which the third protrusion passes, wherein a side surface of the second protrusion is spaced apart from the first hole, and the housing includes a protruding part disposed on a side of the second hole and extending toward the third protrusion.

Camera actuator and camera module comprising same

An electrophoretic particle according to an embodiment contains carbon black, and the electrophoretic particle comprises: a core portion; and a shell portion disposed to surround the outer surface of the core portion, wherein a protrusion portion is formed on the surface of the core portion, the core portion has a chromaticity index of 2 or less, the core portion has a light absorption rate of 90% to 99%, and the particle diameter of the electrophoretic particles is 50 nm to 800 nm.

Electrophoretic particle and light route control member having the same

A power generation apparatus according to one embodiment of the present invention, comprises: a cooling unit, a first thermoelectric module including a first thermoelectric element disposed on a first surface of the cooling unit, and a first heat sink disposed on the first thermoelectric element; and a first wiring part connected to the first thermoelectric element, wherein the cooling unit has a fluid receiving part formed in a first area thereof and a tunnel formed in a second area thereof, and the first wiring part passes through the tunnel.

Power generation apparatus

A power generation apparatus according to an embodiment of the present invention comprises: a cooling unit, a thermoelectric module comprising a thermoelectric element disposed on one surface of the cooling unit, and a heat sink disposed on the thermoelectric element; a guide plate disposed opposite the thermoelectric module; and a branch unit disposed on another surface perpendicular to the one surface of the cooling unit. The heat sink includes multiple heat dissipation fins which are spaced apart from each other. The ratio of the shortest horizontal distance between the heat sink and the guide plate to the shortest horizontal distance between the branch unit and the guide plate is 0.0625 to 0.25.

A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a thermoelectric element disposed on the first substrate; a second substrate disposed on the thermoelectric element and having a smaller area than the first substrate; a sealing part disposed on the first substrate and surrounding a side surface of the thermoelectric element; and a wire part connected to the thermoelectric element, drawn out through the sealing part, and supplying power to the thermoelectric element, wherein the sealing part has a through hole through which the wire part passes, and the through hole is disposed closer to the second substrate than the first substrate.

Thermoelectric module

An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

Epoxy resin compound and radiant heat circuit board using the same

A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.

Printed circuit board and light-emitting device including same

A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

Light emitting element module

An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition

There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

Growing community of inventors

Seoul, South Korea

Jeung Ook Park