General Electric Company

Jessica Lynn Abraham

Jimmie Autrey Beacham

Charles Edward Baumgartner

Jessica Licardi Subit

David A Chartrand

Scott William Easterbrook

Bjornar Sten-Nilsen

Brian John Masterson

Rolf Johannessen

Trym Eggen

A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.

Backing component in ultrasound probe

A method includes the steps of measuring a surface profile of a first component, determining a profile of a second component, the profile of the second component being configured to correspond to the surface profile of the first component, and manufacturing the second component utilizing additive technology in accordance with the determined profile.

System and method for manufacturing an ultrasound probe lens

An acoustic stack is described, where the acoustic stack comprises a plurality of acoustic stack components, which are laminated with an accelerated cure adhesive, which comprises an epoxy resin. The epoxy resin comprises one or more modified epoxy resins, which are selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. Further described is a method for producing an acoustic stack. The method comprises providing a plurality of acoustic stack components and dispensing an accelerated cure adhesive to the acoustic stack components. The accelerated cure adhesive dispensed on, to, and/or in the acoustic stack components includes an epoxy resin, which comprises at least one modified epoxy resin selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. After the accelerated cure adhesive is dispensed to the acoustic stack components, the accelerated cure adhesive is cured.

Method and apparatus for ultrasound transducer arrays with accelerated cure adhesives

An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

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Chandler, AZ, United States of America

Jessica Lynn Abraham