Adeia Semiconductor Solutions LLC

Jessica Dechene

Joe Lee

Benjamin D Briggs

Elbert Huang

Thedorus E Standaert

A method of forming a semiconductor device having a vertical metal line interconnect (via) fully aligned to a first direction of a first interconnect layer and a second direction of a second interconnect layer in a selective recess region by forming a plurality of metal lines in a first dielectric layer; and recessing in a recess region first portions of the plurality of metal lines such that top surfaces of the first portions of the plurality of metal lines are below a top surface of the first dielectric layer; wherein a non-recess region includes second portions of the plurality of metal lines that are outside the recess region.

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Latham, NY, United States of America

Jessica Dechene