Phononic Devices, Inc.

Phononic, Inc.

Phononic Device, Inc.

Jesse W Edwards

Robert Joseph Therrien

Abhishek Yadav

M Sean June

Devon Newman

Marshall S Stanley

Daniel Barus

Robert B Allen

Ricardo E Rodriguez

Paul Brian McCain

Daniel Swann

Simbarashe Nyika

Brian Alfred Williams

Kevin Shawne Schneider

Edward Joseph Karwacki, Jr

Jason D Reed

Arthur Prejs

Mattias K-o Olsson

Frank Holton

Austin J Lewis

Mattias Olsson

Alex R Guichard

Justin W English

Erik P Miller

Iii James Barton Summers

Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture

Systems and methods for thermoelectric refrigerated/frozen product storage and transportation are provided. A cooler includes active thermoelectric cooling to maintain internal temperature within cold chain or customer requirements. The active cooler can be used for storage and transportation of refrigerated and frozen food stuffs, medical or biological products, etc. The active cooler maintains stable and uniform temperature control. A drop in module (e.g., removable/replaceable) can convert any insulated box to active cooling. This can be a commercial transport tote that provides high efficiency. The control logic can be enabled as an API to offer remote monitoring/control to utilize on board, wireless, and networked. A use profile can be customized, and a subscription software package can enable this. The solutions described herein can be used across the whole commercial spectrum and can be ready to integrate into large quantity fleet systems.

Thermoelectric refrigerated/frozen product storage and transportation cooler

A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

Multi header for thermoelectric device

A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Hybrid vapor compression/thermoelectric heat transport system

At least one forced convection unit added to a passive heat transport system is operated during transient heat loading periods but not operated under steady state conditions for cooling and maintaining a set point temperature of a chamber or surface. Forced convection is selectively employed based on temperature data and/or set point temperature values. A reject heat transport system includes first and second reject heat sinks each coupled via main and crossover transport tubes to first and second reject heat exchangers, permitting both heat sinks to dissipate heat from first and second thermoelectric heat pumps regardless of whether the first, the second, or the first and second heat pumps are in operation.

Enhanced heat transport systems for cooling chambers and surfaces

A micro-climate control system includes a thermoelectric system integrated with a fan assembly. The thermoelectric system is operable to actively cool or heat air as the air passes through the fan assembly. The thermoelectric system includes a thermoelectric heat pump, a heat reject subsystem, and a heat accept subsystem. The fan assembly is operable to draw air from a space to be conditioned and output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned and output air passed through the other away from the space to be conditioned. In this way, the micro-climate control system may provide localized comfort, while allowing a larger climate control system to maintain a more efficient temperature set point. In this way, the overall energy consumption may be reduced while providing the same level of effective comfort.

Cooled fan for micro-climate control

Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Systems and methods for mitigating heat rejection limitations of a thermoelectric module

A method of controlling a heat exchanger including thermoelectric coolers to maintain set point temperature of a chamber. The method includes receiving temperature data indicative of a temperature of the chamber and selectively controlling two or more subsets of thermoelectric coolers based on the temperature of the chamber. Selectively controlling the two or more subsets includes operating each thermoelectric cooler in a first subset at or near the point where the coefficient of performance is maximized (Q) by providing a current or voltage with amplitude corresponding to Q(I, V) when the temperature of the chamber is within a predefined steady state range including the set point temperature.

Thermoelectric refrigeration system control scheme for high efficiency performance

The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser

Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Hybrid fan assembly and active heating pumping system

Systems and methods are disclosed herein relating to an Alternating Current-Direct Current (AC-DC) power conversion system for supplying power to one or more Thermoelectric Coolers (TECs). In some embodiments, a system comprises one or more TECs and an AC-DC power conversion system configured to supply power to the one or more TECs for a high efficiency mode of operation and a high heat pumping mode of operation. The AC-DC power conversion system comprises a first AC-DC power converter configured to convert an AC input to a DC output at a first output power level for the high efficiency mode of operation of the one or more TECs. The AC-DC power conversion system further comprises a second AC-DC power converter configured to convert the AC input to a DC output at a second output power level for the high heat pumping mode of operation of the one or more TECs.

High-efficiency power conversion architecture for driving a thermoelectric cooler in energy conscious applications

A thermoelectric refrigeration system including at least one cooling chamber and a thermoelectric heat exchange system. The thermoelectric heat exchange system includes cascaded heat sinks. The cascaded heat sinks include cascaded cold side heat sinks and a hot side heat sink. The cascaded cold side heat sinks include a first cold side heat sink and a second cold side heat sink. The thermoelectric heat exchange system also includes a first plurality of thermoelectric coolers disposed between the first cold side heat sink and the second cold side heat sink and a second plurality of thermoelectric coolers disposed between the second cold side heat sink and the hot side heat sink. Each thermoelectric cooler is a module including multiple thermoelectric devices.

Thermoelectric heat exchange system comprising cascaded cold side heat sinks

A thermoelectric refrigeration system includes a heat exchanger that includes a cold side heat sink and a hot side heat sink. The thermoelectric refrigeration system also includes a heat exchange loop coupled to one of the cold side heat sink and the hot side heat sink, the heat exchange loop operating according to thermosiphon principles to provide passive two-phase transport of a working fluid through the heat exchange loop. The thermoelectric refrigeration system also includes thermal insulation that thermally insulates the heat exchanger from a cooling chamber of the thermoelectric refrigeration system or an environment that is external to the thermoelectric refrigeration system.

Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system

A two-phase heat exchanger includes a hot side heat sink, a cold side heat sink, and one or more thermoelectric modules disposed between the hot side heat sink and the cold sink heat sink such that hot sides of the one or more thermoelectric modules are thermally coupled to the hot side heat sink and cold sides of the one or more thermoelectric modules are thermally coupled to the cold side heat sink. The two-phase heat exchanger is configured to be mounted at an angle from vertical.

Two-phase heat exchanger mounting

A thermoelectric system includes a cooling chamber and a thermoelectric heat exchange system. The thermoelectric heat exchange system includes a hot side heat sink, a cold side heat sink that is physically separated from the hot side heat sink, and a heat conduit that thermally couples the hot side heat sink and the cold side heat sink.

Growing community of inventors

Wake Forest, NC, United States of America

Jesse W Edwards