Texas Instruments Corporation

Jesse Rojas

Carl Albert Vickery, Iii

James D Goon

Robert A Tuerck

Troy M Loveday

The number of good IC (Integrated Circuit) chips per wafer or time to print a wafer is optimized by examining a number of prospective chip-to-wafer offsets, and, for each offset, a number of prospective arrangements of reticle exposures (shot maps). Integrating such a shot map optimization sub-system with a reticle layout (frame generation) sub-system permits creation of an optimal shot map for an IC chip of known size. These two sub-systems can also be used iteratively to explore a range of possible chip sizes, presenting the results in a simple graphical form. The instant invention integrates shot map optimization, frame generation and chip size optimization/visualization into a single system, providing the chip designer with insight into the impact of chip size on manufacturability.

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Plano, TX, United States of America

Jesse Rojas