Ttm Advanced Circuits, Inc.

Johnson Matthey Inc.

Honeywell International Inc.

Honeywell Advanced Circuits, Inc.

Johnson Matthey Electronics, Inc.

Ttm Advanced Technologies, Inc.

Jesse L Pedigo

Nancy E Iwamoto

Alan Grieve

Timothy Meyer

Charles W Lewis

Bruce W Lee

Joseph Schug

Xiao-Qi Zhou

Shao Wei Li

Stephen Tisdale

A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.

Filling device

An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.

Etched hole-fill stand-off

An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

Compliant pre-form interconnect

Hole filling using an etched hole-fill stand-off

Apparatus for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

PCB support plate for PCB via fill

A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Scavenging system

A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head&bsol;, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Heated filling device

A method for filling vias in an electronic substrate which includes providing a source of fill material; providing a pressure head coupled to the source of fill material via a fill material inlet, the pressure head further comprising an elongated fill material outlet which is substantially larger than the fill material inlet; placing the pressure head in contact with the electronic substrate; and pressurizing the fill material to inject fill material into the vias of the electronic substrate.

Filling method

Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

PCB support plate method for PCB via fill

A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Heated filling method

Scavenging method

A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Via fill formulations which are electrically and/or thermally conductive, or non-conductive

A method is described for decreasing bleed from an organic-based formulation comprising incorporating in the organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.6 angstroms; (b) a ratio of formula weight to number of heavy atom bonds of 13 to 16 grams; (c) a ratio of formula weight to end-to-end distance of 18 to 22 grams/angstrom; (d) a ratio of heavy atoms to heavy atom bonds of 1 to 1.1; (e) a ratio of weight fraction of carbon to formula weight of 0.7 to 0.95; (f) a ratio of formula weight to number of carbon to carbon bonds of 14 to 20 grams; and/or (g) 1 to 2 heteroatoms. Also described as an organic-based formulation is disclosed that comprises a filler, a resin and an organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.6 angstroms; (b) a ratio of formula weight to number of heavy atom bonds of 13 to 16 grams; (c) a ratio of formula weight to end-to-end distance of 18 to 22 grams/angstrom; (d) a ratio of heavy atoms to heavy atom bonds of 1 to 1.1; (e) a ratio of weight fraction of carbon to formula weight of 0.7 to 0.95; (f) a ratio of formula weight to number of carbon to carbon bonds of 14 to 20 grams; and/or (g) 1 to 2 heteroatoms.

Growing community of inventors

Chippewa Falls, WI, United States of America

Jesse L Pedigo