Motorola Corporation

Motorlla, Inc.

Jesse E Galloway

William H Robertson, Jr

Sivakumar Muthuswamy

Andrzej T Guzik

Richard A Ceraldi

Scott G Potter

David E Reiff

Joseph Guy Gillette

Pradeep Lall

Craig K Gygi

MacWilliam Branan

Zane Eric Johnson

A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) ( ) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints, or joints in the vicinity of the worst case joints, are changed in pad dimension and exposed to more ball/bump conductive material than the other more robust joints ( ) in the IC ( ) to create a ball ( ) on a larger pad ( ) that is larger than the normal sized ball ( ). The larger balls ( ) are formed by placing multiple smaller balls ( ) together on a single pad ( ) to form one larger ball ( ) during a reflow operation. The larger ball ( ) improves the overall IC reliability by improving the reliability of the weakest joints in the IC design. In addition, the standoff of both the larger balls ( ) and the smaller balls ( ) are engineered to be substantially equal.

Method and apparatus for extending fatigue life of solder joints in a semiconductor device

An intercooled electronic device, includes a thermally conductive chassis (110), a substrate (120) mounted onto the chassis (110), a housing (104) formed around the chassis (110), and a cooling fan (130) mounted internally within the housing (104). The substrate (120) carries electrical circuitry including at least one heat-generating component (122) which is thermally coupled to the chassis (110). The cooling fan (130) is oriented to direct air across the chassis (110).

Intercooled electronic device

Growing community of inventors

Hialeah, FL, United States of America

Jesse E Galloway