Northrop Grumman Systems Corporation

Leland Stanford Junior University

Jesse B Tice

John A Starkovich

Edward M Silverman

Hsiao-Hu Peng

Michael T Barako

Kenneth E Goodson

Vincent Gambin

Xianglin Zeng

Andrew D Kostelec

Max H Kuciej

Andrew Donovan Smith

Xing Lan

Steven J Mass

Vesna Radisic

Daniel R Scherrer

Mark William Knight

Michael D Lange

Jimmy Hester

Loan T Le

Patrick J Case

Dwight L Ritums

Lance M Baird

Nadine Y DeCino

Deborah Minnichelli

Patrick W Shindo

Connor Limburg

Hsiao H Peng

Evan P Nguyen

A Multi-Layer Insulation includes a fixed membrane, a flexible membrane, and at least one electrical insulating layer. The fixed membrane adjoins a substrate. The fixed membrane includes a fixed electrical conducting layer. The flexible membrane includes a thermal insulator and a flexible electrical conducting layer. The flexible membrane is configured to furl into a rolled condition absent application of a voltage across the fixed electrical conducting layer and the flexible electrical conducting layer and is configured to unfurl over the fixed membrane responsive to application of a voltage across the fixed electrical conducting layer and the flexible electrical conducting layer. The at least one electrical insulating layer is located between the fixed electrical conducting layer and the flexible conducting layer. The at least one electrical insulating layer is chosen from a fixed electrical insulating layer of the fixed membrane and an inner electrical insulating layer of the flexible membrane.

On-demand multi-layer insulation, radiator panels including same, and space vehicles including such radiator panels

An aircraft skin coating assembly for an aircraft. The coating assembly includes a primer layer deposited on the aircraft skin, an optical stop-etch layer deposited on the primer layer that is reflective at a predetermined wavelength, a coating stack-up deposited on the optical etch-stop layer that provides performance features for the aircraft, and a sealant layer deposited on the stack-up. When a laser coating removal process employing a laser beam is used to remove the coating stack-up for replacement, the stop-etch layer reflects the laser beam to prevent it from penetrating and possibly damaging the aircraft skin.

Multi-functional layer for stop etch in laser coating removal

A multilayered metal nanowire array including a plurality of stacked and separated nanowire array layers each including a plurality of vertically aligned metal nanowires, and a lateral interposer positioned in a gap between each pair of adjacent nanowire array layers and being thermally coupled to the nanowires in the adjacent layers so that the lateral interposers provide thermal conduction between the nanowire array layers and laterally across each nanowire array layer. The nanowire array layers between the interposers can have the same or different thicknesses, the diameter and density of the nanowires can be the same or different, and the nanowire metal can be the same or different.

Multilayered metal nanowire array

A semiconductor device is provided with a first layer having a first layer conductive contact and being doped at a first concentration of a first dopant type. The first dopant type being a P type dopant. A second layer is on top the first layer and being doped at a second concentration of the first dopant type. The second concentration being less than the first concentration. A third layer is on top of the second layer and having a third layer conductive contact and being doped with a second dopant type, the second dopant type being an N type dopant. A fourth layer is on top of the third layer and having a fourth layer conductive contact and being doped with the first dopant type, wherein at least one of the first and second layers is a boron arsenide (BAs) layer.

Semiconductor device passive thermal management

Cubic BAs is used in semiconductors to improve the thermal characteristics of a device. The BAs is used in device layers to improve thermal conductivity. The BAs also provides thermal expansion characteristics that are compatible with other semiconductors and thereby further improves reliability. The substrates of the semiconductors may also include vias that contain BAs. The BAs in the vias may contact the BAs in the device layers. Some vias may have a surface area to volume ratio of greater than 10 to better assist with device heat dissipation.

An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

Direct write, high conductivity MMIC attach

A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.

Multilayered nanowire arrays with lateral interposers

A method for wafer-level deposition of a semiconductor layer structure including at least one two-dimensional black phosphorus layer. The method includes providing a wafer substrate and a metal catalyst layer on the substrate. The method includes heating a phosphorus material to generate a Pflux and heating the Pflux to generate a Pflux, where the Pflux is deposited on the metal catalyst layer using molecular beam epitaxy or chemical vapor deposition. The process of depositing the black phosphorus layer can include adding a dopant or alloy to the Pflux to modify the band gap of the phosphorus layer. The method includes heating the substrate to a temperature above a temperature that causes red phosphorus to evaporate from the substrate, but does not cause black phosphorus to evaporate from the substrate.

Wafer-scale catalytic deposition of black phosphorus

A microstrip transmission line comprising a dielectric substrate including a series of periodic sinusoidal undulation portions defining spaced apart peaks and troughs, where a distance between the peaks and troughs defines a period of the microstrip line, and where each peak defines a maximum height of the substrate and each trough defines a minimum height of the substrate. The transmission line further includes a conductive strip formed to a surface of the substrate so that the conductive strip follows the undulation portions. The conductive strip includes a modulation portion in a width direction of the conductive strip perpendicular to a signal propagation direction along the strip, where the modulation portion includes a minimum width portion provided at each peak and a maximum width portion provided at each trough so that a variation of a ratio between the width of the conductive strip and the height of the substrate is maximized.

3D RF-substrate patterning

A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Alloy bonded graphene sheets for enhanced thermal spreaders

A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

High-conductivity bonding of metal nanowire arrays

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

Large-scale reconfigurable electronics using low cost nanoparticle ink printing method

A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.

Compressible, thermally-conductive, removable nanocomposite gasket

A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Growing community of inventors

Torrance, CA, United States of America

Jesse B Tice