Honeywell International Inc.

Jesse A Vaught

Matthew Brady McEwen

Henry H Hung

John H Shannon

Karl A Fetting

Matthew A Olson

John R Leonard

Wesley H Williams

A magnetic shielding system for a fiber optic gyroscope is disclosed. The fiber optic gyroscope may have a sensing coil with a sensing axis. An exemplary magnetic shield may enclose the sensing coil and have a layer including a plurality of pieces connected at a seam. A portion of the seam may be substantially parallel to the sensing axis of the sensing coil. Also, the pieces may be connected together such that each piece has a portion of each of two sides and a wall of the magnetic shield. Additionally, multiple layers having orthogonal seams may be utilized with the magnetic shield.

Magnetic shield for a fiber optic gyroscope

A magnetic shield has a multiple-layered lid and a multiple-layered base, wherein each layer of the lid is aligned with the corresponding layer of the base. The magnetic shield also includes an alignment mechanism to maintain the alignment of the corresponding layers of the lid and the base of the shield.

Magnetic shield for optical gyroscopes

An Integrated Optics Chip (IOC) package for an IOC, including a base having an upper support surface having a first raised surface and a dielectric gel disposed on the first raised surface of the base and adapted to couple to the IOC. The dielectric gel is sufficiently compliant to minimize stresses from structural changes in the base, accommodate a thermal mismatch between the IOC and the base, and reduce vibration. A first adhesive may be applied to a platform integral to the base that is sufficiently rigid to prevent the IOC from separating from the dielectric gel during vibration. A second adhesive may be applied on a second raised surface of the base to provide strain relief to the leads of the IOC. Advantages include the elimination of several components and manufacturing steps, improved strain relief and vibration dampening, as well as manufacturing time and cost savings.

Submountless integrated optics chip package

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Phoenix, AZ, United States of America

Jesse A Vaught