Tektronix, Inc.

Jerry R Shane

J Steven Lyford

Marc A Gessford

Mark W Nightingale

William Q Law

Jonathan E Myers

William R Pooley

Daniel J Ayres

M David Swafford

Michael L Kyle

Lawrence M LeMon

A ground spring for receiving a ground end of a high-frequency test probe is described. The ground spring includes a generally annular base portion, and a number of elongated spring fingers extending from the base portion. The fingers extend generally radially inwardly from the base portion and have inner end faces that together define a substantially circular opening in a center portion of the ground spring. Each of the fingers have a tapered shape including a wider base portion end and a narrower inner end portion Each of the fingers has a longitudinal axis that is aslant relative to a reference line extending from the center of the ground spring to a center of the base portion of each finger. BMA connectors including the ground spring and test and measurement devices are also described.

Ground spring with strain relief

An electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility includes a closely mating pocket and body, each attached to a respective male or female side of the interconnect. Additional data and power connectors may be included with the pocket and body.

Electronic interconnect device for high speed signal and data transmission

Growing community of inventors

Portland, OR, United States of America

Jerry R Shane