Staktek Corporation

Other

Cube X Incorporated

Staktek Group L.p.

Jerry Mark Roane

Carmen D Burns

James W Cady

Phillip R Troetschel

John D Neff

Matthew T Verona

Peter Herbert Cherouny

Manuel Campero

Philip R Troetschel

A computer simulation enhanced exercise device is provided which engages the user by directly relating the users exercise motion in real time to a visual simulation or interactive game. The exercise device may comprise any variety of machines including, stationary bikes, rowing machines, treadmills, stepper, elliptical gliders or under desk exercise. These exercise devices are configured with sensors to measure physical movements as the user exercises and are coupled to computer hardware with modeling and virtualization software to create the system. These sensor measurements are then sent to a computer for use in the physics based modeling and real-time visual simulation. The computer simulation enhanced exercise device is further provided with features including manual and automatic adjustment of resistance levels, visualization of accurate caloric burn rates and correlation to everyday food items, and network connectivity providing for multiplayer network simulations and directed advertising.

Interactive computer simulation enhanced exercise machine

A rail system for transporting dual use vehicles includes a network of multiple non-interconnected rails where each rail comprises an extruded triangular shell and a support material. The rails are supported by a system of support structures where each support structure includes a base with a rail adjustment actuator for selectively adjusting the position of the supported rail. Each rail is sized to support a standardized dual use passenger vehicle adapted for roadway and rail travel.

Production vehicle for tritrack transportation system

Tritrack system of mass transit

The instant invention utilizes a programmable circuit which has a 186EM Micro controller therein to operate a circuit which integrates peripherals such as a memory controller, a programmable input and output, a timer and serial controller to increase system functionality and lower cost. The entire CPU circuit is mounted in a vehicle near the steering wheel where the key fob of the particular driver can be inserted for driver identification. There is an electronic box mounted forward of the firewall that contains the module specific for the brand of vehicle. The CPU module is wired to the under the hood box and a connection to that wiring in the back of the dash mounting holder. The holder guides the CPU module into the connector as the CPU module is inserted into the holder. The programmable unit is contained in a module which controls the speed of the vehicle and the memory function of the module itself. The unit is essentially a hand-held computer that is an integrated, low-voltage, single chip implementation of a high-performance 16 bit, x86 compatible microprocessor with the extra logic needed for PC/AT-compatible PCs. It has an AM 386 CPU core with a memory control unit, ISA bus controller and peripheral control logic.

Electronic programmable speed limiter

The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.

Warp-resistent ultra-thin integrated circuit package fabrication method

A method and apparatus for numbing tissue before a shot is inserted into the tissue wherein said method and apparatus provide a vibratory force the tissue, thereby overexciting the nerves in the tissue and blocking the nerves' ability to sense pain.

Method and apparatus for numbing tissue before inserting a needle

The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.

High density integrated circuit module with complex electrical

Method of manufacturing a high density integrated circuit module having

Warp-resistant ultra-thin integrated circuit package

Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. These level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.

Ultra high density integrated circuit packages

The present invention provides capacitive and/or power supply decoupling for an integrated circuit package by utilizing an externally mounted bypass capacitor between power and ground. The bypass capacitor is mounted on internal leads projecting into a cove area formed at one or both ends of an integrated circuit package whereby one such internal lead is connected to the external power lead and the other such internal lead is connected to the external ground lead. A flexible, high-temperature adhesive material is used to secure the capacitor to the internal leads in the cove of the IC package so that when the package is later subject to soldering temperature thereby softening the solder connections between internal leads and the capacitor, the capacitor will not be electrically or physically disconnected from the internal leads. The adhesive secures the capacitor in place until the high temperatures dissipate and the solder joints between capacitor and the internal leads harden. A second cove formed at the opposite end of the integrated circuit package allows integrated circuit packages to be stacked alternately, one on top of another, so the cove portion of each integrated circuit package provides clearance for the capacitor mounted immediately above or below each respective stacked integrated circuit package. In this manner, an ultra high density integrated circuit package comprising stacked discrete integrated circuit packages can be formed and capacitively decoupled.

Capacitive coupling configuration for an intergrated circuit package

A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.

Method of assembling ultra high density integrated circuit packages

Thin and durable level-one and level-two integrated circuit packages are provided. Moisture-barriers may be provided to upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may be constructed with one or more metal layers to prevent warpage. These level-one packages are aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors are thermally coupled to the level-two package to help dissipate heat.

Growing community of inventors

Austin, TX, United States of America

Jerry Mark Roane